Protectronics Technology Corporation

Industrial Technology Research Institute

Chen-Ron Lin

Kun-Huang Chang

Shu-Chin Chou

Ren-Haur Hwang

Der-Yang Liu

Wei-Wen Yeh

The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal. Finally, a thermal-laminating process is performed to laminate a polymeric composite material on the composite electroplating layer to form the composite materials of the positive temperature coefficient thermistor device, wherein the polymeric composite material is conductive crystallized and filled with the carbon black.

Method for preparing composite materials of a positive temperature coefficient thermistor

A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.

Structure for polymeric thermistor and method of making the same

The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.

Structure for composite materials of positive temperature coefficient thermistor devices and method of making the same

This invention provides a method for making an electrode film for a composite polymer material. A composite plating method is used to form a conductive plate film with microrough surface of 0.01 to 100 microns which will be adhered to a composite polymer material, enhances the adhering performance and reduces the interface electrical resistance.

Method for making electrode of polymer composite

The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode. There is good adhesion strength between the porous electrode and the conductive material-filled polymer composite, and the interfacial resistance is decreased.

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Hsinchu, Taiwan

Chen-Ron Lin