Industrial Technology Research Institute

Tyntek Corporation

Other

Changhua Christian Hospital

Chao-chin Chang

Chen-Peng Hsu

Hung-Lieh Hu

Yao-Jun Tsai

Chien-Chun Lu

Shih-Yi Wen

Chao-Wei Li

Zhi-Wei Koh

Chia-Fen Hsieh

Ji-Feng Chen

Yen-Hsiang Fang

Yu-Chen Yu

Chen-Kun Chen

Cheng-Da Shaw

Chien-Jen Sun

Kuan-Chieh Tu

Chih-Tsung Shih

Mu-Tao Chu

Yi-Keng Fu

Hsun-Chih Liu

Chao-Chin Chang

Hsin-Yun Tsai

Chi-Chin Yang

Kuo-Feng Lin

Karthickraj Muthuramalingam

Hsiao-Wen Chang

Chia-Chun Yu

Yen-Chu Li

Chun-Yi Tung

Re-Ching Lin

Wen-Yung Yeh

Rong Xuan

Chun-Chuan Lin

Chun-Hsing Lee

Ya-Hui Chiang

Chih-Hao Hsu

Hsin-Hsiang Lo

Chia-Tai Kuo

Yu-Hsiang Chang

Kun-Fong Lin

Bing-Ru Chen

Hung-Ming Wu

Shih-Tsai Huang

Chao-Wei Lee

The disclosure is directed to an air purifier and an automobile air conditioner with an air purifier. The air purifier includes a reactor, a column, an air guider and a plurality of light emitting elements. The reactor includes an air inlet and an air outlet. The column is disposed in the reactor, and the column has a N-side walls. The air guider is disposed on the column, and the air guider is coated with a photocatalyst. The light emitting elements are placed on the N side walls of the column configured to irradiate on the photocatalyst, where each of the light emitting elements has an emitting angle of &#x3b8; and &#x3b8;*N&#x3e;360&#xb0;.

Air purifier and automobile air conditioner with air purifier

A fluid sterilizing device includes a first reaction chamber, a second reaction chamber, a communication chamber and a light source. The first reaction chamber is connected to a fluid inlet. The second reaction chamber is connected to a fluid outlet. The communication chamber is connected the first reaction chamber with the second reaction chamber. The light source is configured to emit sterilization light to enter the first reaction chamber and the second reaction chamber. The fluid inlet allows a fluid to enter the first reaction chamber, the communication chamber allows the fluid to pass through and enter the second reaction chamber, and a flow velocity distribution of the fluid in the second reaction chamber is different from that of the fluid in the first reaction chamber.

Fluid sterilizing device

A purifying device including a container, at least one cover, a sensing assembly and an ultraviolet source is provided. The container has a containing space, wherein the containing space is adapted to contain a liquid. The cover is adapted to be connected to the container to cover the containing space. The sensing assembly is disposed on the cover, wherein the sensing assembly is adapted to sense a usage state of the cover. The ultraviolet source is disposed on the cover and is adapted to generate an ultraviolet emitted to outside of the cover, wherein the ultraviolet source is turned on or turned off according the usage state of the cover.

Purifying device

A light source apparatus comprises a main body, a plurality of light source modules and a processor. The main body includes a plurality of configuration areas distributed on a surface of the main body. The plurality of configuration areas is oriented towards different directions, respectively. The plurality of light source modules is located in the plurality of configuration areas, respectively. Each of the plurality of light source modules includes a circuit substrate and an ultraviolet emitting device. The processor is electrically connected to the plurality of light source modules. The processor is adapted to drive the ultraviolet emitting device of each of the plurality of light source modules. A method of using a light source apparatus is also provided.

Light source apparatus and method of using the same

A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.

Package structure of an ultraviolet light emitting diode

Sterilization container

Container

In an embodiment, a sterilization apparatus, adapted to sterilize a liquid to be sterilized, comprises a first sterilization light source, a first container and a sterilization container. The first sterilization light source includes a carrier, a plurality of LED packages and a plurality of collimating units, wherein the plurality of LED packages are disposed on and electrically connected to the plurality of carriers, and each of the plurality of collimating units separately is disposed on a corresponding LED package. The first container accommodates the first sterilization light source, and defines a first light-mixing space. The sterilization container includes an accommodating space for accommodating the liquid, wherein the first container is assembled together with the sterilization container, and the first light-mixing space is disposed between the first sterilization light source and the accommodating space.

Sterilization apparatus

A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. A light extraction layer with a roughened structure is formed on the doped semiconductor layer to improve the light emitting efficiency of LED. Furthermore, the strength of the semiconductor stacked structure can be enhanced by the light extraction layer, to improve the reliability of the LED and the production yields of manufacturing process.

Light emitting diode

A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. An undoped semiconductor layer over the first semiconductor layer may be not removed or not completely removed to increase the strength of the semiconductor stacked structure and improve the reliability of the LED and the production yields of manufacturing process. A roughened structure (or a photonic crystal) can be formed on the undoped semiconductor layer when the semiconductor stacked structure to improve the light emitting efficiency of the LED.

A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode.

Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes.

Substrate, method of fabricating the same, and application the same

A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.

Light emitting diode package structure

An light device, includes a plurality of first light cells arranged axisymmetrically about an axis; a plurality of second light cells arranged axisymmetrically around the axis; and a controller coupled to a brightness adjust unit, and determines whether to activate the first light cells and second light cells according to a brightness adjust value of the brightness adjust unit, wherein the average distance between the first light cells and the axis is shorter than the average distance between the second light cells and the axis.

Light devices

A method for fabricating a wafer-level light emitting diode structure is provided. The method includes: providing a substrate, wherein a first semiconductor layer, a light emitting layer, and a second semiconductor layer are sequentially disposed on the substrate; subjecting the first semiconductor layer, the light emitting layer, and the second semiconductor layer with a patterning process to form a first depressed portion, a second depressed portion, a stacked structure disposed on the second depressed portion and a remained first semiconductor layer disposed on the depressed portion, wherein the stacked structure comprises a patterned second semiconductor layer, a patterned emitting layer, and a patterned first semiconductor layer; forming a first electrode on the remained first semiconductor layer of the first depressed portion; and forming a second electrode correspondingly disposed on the patterned second semiconductor layer of the second depressed portion.

Wafer-level light emitting diode structure, light emitting diode chip, and method for forming the same

Growing community of inventors

Kaohsiung, Taiwan

Chen-Peng Hsu