Lumination LLC

Gelcore, LLC

Ge Lighting Solutions LLC

Chen-Lun Hsing Chen

Stanton Earl Weaver, Jr

Thomas Frederick Soules

Alok Mani Srivastava

Anant Achyut Setlur

Holly Ann Comanzo

Emil Vergilov Radkov

Ivan Eliashevich

Thomas Elliot Stecher

Sebastien Libon

Steven Francis LeBoeuf

Mehmet Arik

Joseph John Shiang

Stephen Daley Arthur

David Mulford Shaddock

Mathew L Sommers

Hari S Venugopalan

Charles Adrian Becker

Boris Kolodin

Bryan S Shelton

Cherian Jacob

Rebecca A Bompiedi

Anan Achyut Setlur

An edge lit illumination system is directed to providing backlighting utilizing a luminescent impregnated lightguide. The apparatus includes an LED radiation source providing a first radiation and a lightguide optically coupled to the LED radiation source including a luminescent material embedded or coated on an output surface of the lightguide designed to absorb the first radiation, and emit one or more radiations. The illumination system may further include additional optical components such as reflective layers, for directing radiation striking the back surfaces of the light guide back into the lightguide, as well as diffusion layers, UV reflectors, and polarizers.

LED-based edge lit illumination system

A lighting apparatus () comprises a light engine () producing ultra violet radiation. An enclosure () surrounds a radiation generating area of the light engine () to encompass the radiation. At least one wall () of the enclosure () is substantially reflective of the ultraviolet radiation. The enclosure () includes a replaceable top portion () which includes a phosphor portion (). The phosphor portion () is spaced from the radiation generating area of the light engine () by a height of the enclosure ().

Method and apparatus for LED panel lamp systems

An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

Coated LED with improved efficiency

A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.

Luminescent sheet covering for LEDs

A light emitting diode () has a backside and a front-side with at least one n-type electrode () and at least one p-type electrode () disposed thereon defining a minimum electrodes separation (d). A bonding pad layer () includes at least one n-type bonding pad () and at least one p-type bonding pad () defining a minimum bonding pads separation (d) that is larger than the minimum electrodes separation (d). At least one fanning layer () interposed between the front-side of the light emitting diode () and the bonding pad layer () includes a plurality of electrically conductive paths passing through vias () of a dielectric layer () to provide electrical communication between the at least one n-type electrode () and the at least one n-type bonding pad () and between the at least one p-type electrode () and the at least one p-type bonding pad ().

Flip-chip light emitting diode device without sub-mount

Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (). A metal is applied to the drilled openings to produce a plurality of via arrays (). The LED dice () are flip-chip bonded onto a frontside () of the sub-mount wafer (). The p-type and n-type contacts of each flip-chip bonded LED () electrically communicate with a solderable backside () of the sub-mount wafer () through a via array (). A thermal conduction path () is provided for thermally conducting heat from the flip-chip bonded LED dice () to the solderable backside () of the sub-mount wafer (). Subsequent to the flip-chip bonding, the sub-mount wafer () is separated to produce the surface mount LED packages.

LED power package

Growing community of inventors

Taipei, Taiwan

Chen-Lun Hsing Chen