Zhejiang Lingdi Digital Technology Co., Ltd.

Hangzhou Silan Integrated Circuit Co., Ltd.

Hangzhou Silan Microelectronics Co., Ltd.

Powerchina Huadong Engineering Corporation Limited

Hangzhou Silan Integrated Circuits Co., Ltd.

Chen Liu

Yongxiang Wen

Huamin Wang

Feng Ji

Gaofeng He

Huang Chen

Liwen Li

Wei Sun

XiaoLi Zhang

Dundun Shi

Likang Luo

Tanghao Tian

Shiming Liu

Rui Song

Yingchun Zhuang

Wenliang Sun

Wenchao Jin

Fuhe Sun

Zhijian Ma

Junshan Ge

A method and a system for personalized image generation are provided. The method includes: determining a facial description text specified by a user; generating, based on the facial description text, a facial image by using a generative algorithm; obtaining a first dressing effect image of a target garment, the first dressing effect image presenting a wearing effect of the target garment on a digital model; and generating a second dressing effect image of the target garment by performing a fusion operation on the facial image and the first dressing effect image, the second dressing effect image presenting a wearing effect of the target garment on a fused digital model. The provided solution not only enables the rapid, high-quality generation of garment images but also ensures that the fused images maintain feature consistency, meeting users' personalized display preferences.

Methods and systems for personalized image generation

The present disclosure discloses a method for generating texture maps through multi-angle lighting photographing, comprising: constructing a multi-angle lighting photographing environment; photographing color chart images for color correction matrix; photographing white paper images for light intensity correction coefficient; capturing calibration images for transparency calculation; photographing object images for color correction and light intensity correction, including images without backlighting and images with backlighting; generating base color maps, normal maps, metallic maps, roughness maps, and transparency maps. The present disclosure also discloses a storage medium, wherein a computer program is stored, and the computer program is configured to be executed at runtime to perform the above-mentioned method. The present disclosure further discloses an electronic device comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the above-mentioned method.

Method and electronic device for generating texture maps through multi-angle lighting capture

A method and a user device for arranging clothing patterns may be provided. A first user instruction may be received. The first user instruction may be used for selecting a first target location from a two-dimensional (2D) clothing pattern and allocating the 2D clothing pattern to a second target location on a three-dimensional (3D) avatar. In response to the first user instruction, the 2D clothing pattern may be represented as a 3D clothing pattern that warps around the 3D avatar at the second target location.

Systems and methods for arranging and displaying clothing patterns

A method for arranging clothing patterns implemented on a computing device is provided. The method comprise: determining sewing relationships between clothing patterns to be transformed into a digital garment on a 3D avatar; performing iterations to process the clothing patterns, each of the iterations comprising: selecting one or more clothing patterns to be processed in the iteration from the clothing patterns based on the sewing relationships; and arranging the one or more clothing patterns to warp around the 3D avatar; and generating the digital garment that is worn on the 3D avatar by sewing the arranged clothing patterns corresponding to the iterations based on the sewing relationships.

Systems and methods for arranging clothing patterns

A MEMS device and a manufacturing method thereof. The manufacturing method comprises: forming a CMOS circuit; and forming a MEMS module on the CMOS circuit which is coupling to the MEMS module and configured to drive the MEMS module. Forming the MEMS module comprises: forming a protective layer; forming a sacrificial layer in the protective layer; forming a first electrode on the protective layer and on the sacrificial layer so that the first electrode covers the sacrificial layer, and electrically coupling the first electrode to the CMOS circuit; forming a piezoelectric layer on the first electrode and above the sacrificial layer; forming a second electrode on the piezoelectric layer and electrically coupling the second electrode to the CMOS circuit; forming a through hole to reach the sacrificial layer; and forming a cavity by removing the sacrificial layer through the through hole.

MEMS device and manufacturing method thereof

A MEMS microphone and a manufacturing method thereof. The method comprises: sequentially forming a first isolation layer, a diaphragm, and a second isolation layer on a substrate; sequentially forming a first protective layer, a backplate electrode, and a second protective layer on the second isolation layer; forming a release hole penetrating through the first protective layer, the backplate electrode, and the second protective layer; forming an acoustic cavity penetrating through the substrate; releasing the diaphragm through the acoustic cavity and the release hole; and forming a groove on a surface of the first isolation layer, wherein the diaphragm conformally covers the surface of the first isolation layer, thereby forming a spring structure at a position of the groove.

MEMS microphone and manufacturing method thereof

Disclosed a MEMS assembly and a manufacturing method thereof. The manufacturing method comprises: forming a groove on a sensor chip; forming a bonding pad on a circuit chip; bonding the sensor chip and the circuit chip together to form a bonding assembly; performing a first dicing process at a first position of the sensor chip to penetrate through the sensor chip to the groove; performing a second dicing process at a second position of the sensor chip to penetrate through the sensor chip and the circuit chip, for obtaining an individual MEMS assembly by singulating the bonding assembly, wherein location of the groove corresponds to a position of the bonding pad, and an opening is formed in the sensor chip to expose the bonding pad when the second dicing process is performed. The method uses two dicing process respectively achieving different depths to expose the bonding pad of the sensor chip and singulate the MEMS assembly, respectively, to improve yield and reliability.

MEMS assembly and manufacturing method thereof

A deep sludge dewatering method using electroosmosis with filter bags, including (1) placing a filter bag on a slope on which a cathode electrode is arranged; (2) injecting sludge into the filter bag, and after the filter bag is filled with the sludge, closing an inlet of the filter bag; and (3) laying an anode electrode on the filter bag filled with the sludge, and connecting the cathode electrode and the anode electrode to a DC power supply via an electric wire, and carrying out energization for electroosmosis so that water flows down the slope. The present invention can be used for recycling of the sludge produced in underground and tunnel excavation projects, and has the advantages of large processing capacity, simple process, good treatment effect and available resource recycling.

Deep sludge dewatering method using electroosmosis with filter bags

A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S, providing a MEMS sealing cap silicon substrate (); step S, forming n stacked mask layers () on the MEMS sealing cap silicon substrate (), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D, D, D); step S, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S, removing the current uppermost mask layer; step S, repeating the step Sand the step Suntil all the n mask layers are removed. The present invention can form a plurality of deep trenches with high aspect ratio on the MEMS sealing cap silicon substrate using conventional semiconductor processes, avoiding the problem that the conventional spin coating cannot be conducted on a sealing cap wafer with deep trenches using photoresist.

Growing community of inventors

Hangzhou, China

Chen Liu