Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen Kuang-Hsin

Tsung-Yu Chiang

Bor-Zen Tien

Tzong-Sheng Chang

Chi-Hsi Wu

Kuo-Chiang Ting

Joanna Chaw Yane Yin

Chen Chu-Hsuan

Hsin-Lung Chao

Among other things, one or more semiconductor arrangements, and techniques for forming such semiconductor arrangements are provided. A layer, such as a poly layer or an inter layer dielectric (ILD) layer, is formed over a substrate. A photoresist mask is formed over the layer. The photoresist mask comprises an open region overlaying a target region of the layer and comprises a protection region overlaying a second region of the layer. An etching process is performed through the open region to reduce a height of the layer in the target region in relation to a height of the layer in the second region because the protection region inhibits the etching process from affecting the layer in the second region. A first structure, having a first height, is formed within the target region. A second structure, having a second height greater than the first height, is formed within the second region.

Methods for manufacturing semiconductor arrangements using photoresist masks

Back-end-of-line (BEOL) arrangement with multi-height interlayer dielectric (ILD) structures

Semiconductor arrangement having an overlay alignment mark with a height shorter than a neighboring gate structure

The present disclosure provides many different embodiments of a FinFET device that provide one or more improvements over the prior art. In one embodiment, a FinFET includes a semiconductor substrate and a plurality of fins having a first height and a plurality of fin having a second height on the semiconductor substrate. The second height may be less than the first height.

FinFET device

The present disclosure provides many different embodiments of fabricating a FinFET device that provide one or more improvements over the prior art. In one embodiment, a method of fabricating a FinFET includes providing a semiconductor substrate and a plurality of dummy fins and active fins on the semiconductor substrate. A predetermined group of dummy fins is removed.

Method of making a FinFET device

Among other things, one or semiconductor arrangements, and techniques for forming such semiconductor arrangements are provided. An etch sequence is performed to form a first etched region over a planar region of a semiconductor arrangement. The first etched region exposes a planar structure, such as an alignment mark used for alignment during semiconductor fabrication. The etch sequence forms a second etched region over a semiconductor fin region of the semiconductor arrangement. In an embodiment, the etch sequence forms a first trench, a first fin nub and a first pillar in the semiconductor fin region, where the first trench is formed in a semiconductor substrate of the semiconductor fin region. A multi-depth STI structure is formed over at least one of the first trench, the first fin nub, or the first pillar.

Semiconductor arrangement with multiple-height fins and substrate trenches

Methods for forming a semiconductor arrangement with structures having different heights

Growing community of inventors

Jung-Li, Taiwan

Chen Kuang-Hsin