Macronix International Co., Ltd.

Hong Kong Applied Science and Technology Research Institute Company, Limited

Chen Jung Tsai

Chih-Wen Lin

Chih Wen Lin

Huajun Peng

Shou Lung Chen

Pak Hong Ng

Ya-Hsien Chang

Chin Wen Lin

An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Ultra thin image sensor package structure and method for fabrication

A backlight device for providing backlighting to a liquid crystal display panel displaying a video image comprising a plurality of light emitting devices for providing backlighting to a liquid crystal display panel, a controller unit for receiving a video image and dividing the video image into a plurality of sub-images wherein each sub-image corresponds to at least one light emitting device, and for generating driving signals of each light emitting device according to grayscale level characteristics of at least one sub-image.

Backlight device and liquid crystal display incorporating the backlight device

Methods and apparatuses for backlight calibration are described. The apparatuscomprises a backlight unitcomprising a plurality of light sources, at least one photo-sensoradapted to measure the light emitted by the backlight unit, a photo-sensor controllercoupled to the photo-sensorfor controlling the photo-sensor(s), a backlight driving circuitcoupled to the light sourcesfor providing individual driving on each light source, a signal generatorcoupled to the photo-sensor controllerand the backlight driving circuitfor controlling the operation timing of photo-sensorsand each of the light sourcesuch that lighting conditions from each of the light source can be acquired, and a processing unitcoupled to the photo-sensorand the backlight driving circuitfor analyzing the measurement data from the photo-sensorsand providing an adjustment signal to the backlight driving circuitto achieve uniform lighting conditions of the backlight unit. Also described is a method comprising the steps of providing saved settings for backlight driver, providing a modified timing sequence to backlight driver and photo sensor, measuring light conditions of each individual light source or each individual group of light sources in backlight unit, comparing measurement data with predefined light conditions, calculating the adjustment required on backlight drivel to achieve desired light conditions, and saving calculated adjustment as new settings for backlight driver

Methods and apparatus for backlight calibration

An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Method and apparatus for stacking electrical components using via to provide interconnection

Chip stacking structure

A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Ultra thin dual chip image sensor package structure and method for fabrication

Apparatus for stacking electrical components using insulated and interconnecting via

A thin stacked image sensor package containing an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Growing community of inventors

Hsinchu, Taiwan

Chen Jung Tsai