Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen Hua Yu

Chien-Hsueh Shih

Weng Chang

Tsu Shih

Cheng Chung Lin

An exemplary method includes: providing a substrate with exposed metal and dielectric surfaces, performing a reducing process on the metal and dielectric surfaces, and transferring the substrate in an inert or reducing ambient to a chamber for that is used for selective metal layer deposition.

Process for low resistance metal cap

An exemplary method includes: providing a substrate with an exposed metal surface, performing a reducing process on the metal surface, and transferring the substrate in an inert or reducing ambient to a chamber for that is used for metal layer deposition.

Process for making a metal seed layer

Chemical mechanical polishing (CMP) is known to cause dishing when the surface being planarized includes a wide trench partially filled with metal. This problem has been overcome by first filling the trench with a material whose polishing rate under CMP is similar to that of the metal in the trench. Spin-coating is used for this so that only the trench gets filled. After CMP, any residue of this material is removed, leaving behind a surface that has been planarized to the intended extent without the introduction of significant dishing and with minimum erosion of the metal.

Method of reducing dishing and erosion using a sacrificial layer

A bond pad structure that is equipped with a heat dissipating ring surrounding the pad and a method for forming the structure are disclosed. The bond pad structure includes a bond pad that is substantially surrounded and insulated by a layer of inter-metal-dielectric (IMD) material and is formed of two metal layers and a plurality of metal via plugs connected thereinbetween, and a heat dissipating ring surrounding and spaced-apart from the bond pad formed of an upper conductive ring and a lower conductive ring of substantially the same configuration connected thereinbetween by a plurality of dummy via plugs formed of a thermally conductive material. A method for forming the bond pad structure that is equipped with the heat dissipating ring is further disclosed in which three separate IMD layers are provided for forming photolithographically the bond pad structure and the heat dissipating ring simultaneously.

Growing community of inventors

Hsin-Chu, Taiwan

Chen Hua Yu