Nan Ya Plastics Corporation

Chen-Hua Wu

Cheng-Chung Lee

Jaou-Shain Yu

Wei-Ting Wei

Yeong-Tong Hwang

Yu-Shiang Peng

A benzoxazine resin and a method for manufacturing the same, and a resin composition are provided. The benzoxazine resin is obtained from a condensation polymerization reaction of a phenolic compound, formaldehyde, and a primary amine compound that are used as a reactant. The phenolic compound includes a dicyclopentadiene phenol resin and bisphenol A. The primary amine compound includes 2,6-dimethylaniline and m-xylylenediamine. The resin composition includes the benzoxazine resin, an epoxy resin, and a bismaleimide resin. Based on a total weight of the benzoxazine resin, the epoxy resin, and the bismaleimide resin being 100 phr, an amount of the benzoxazine resin ranges from 30 phr to 50 phr.

Benzoxazine resin and method for manufacturing the same

A Formula of a phosphorous fire-retardant hardener having fire-retardant and heat-resistant properties as well as a low-dielectric constant. With a preparation of glass-fiber laminated board, the hardener meets UL-94V fire-retardant requirements and has a dielectric constant 5 of 4.0 (1 GHz).

Low DK phosphorous containing hardener useful for halogen free, flame retardant polymers and use

This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288&#xb0; C. soldering test and 2 hours pressure cooking test.

Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin

The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I)      Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100&#x2dc;450 parts and catalyst 0.01&#x2dc;5 parts are added, stirred and mixed at 90&#x2dc;180, for 1&#x2dc;4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03(1 GHz), dissipation factor is 0.0046(1 GHz) and no delamination longer than 60 minutes dipping in 288soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.

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Taipei, Taiwan

Chen-Hua Wu