Compal Electronics, Inc.

Au Optronics Corporation

Chen-Hua Liu

Shao-Tsu Kung

Guang-Tau Sung

Hung-Jen Chen

Bar-Long Denq

Ru-Jen Chiu

Kai-Yu Sun

Kuo-Chung Lee

Jui-Chuan Chang

A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.

Transfer method using thermal transfer film

A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.

Protective sheet and method for manufacturing the same

A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Method for attaching an integrated circuit package to a circuit board

A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.

Thermal module with temporary heat storage

A flat panel display or a backlight module for homogenizing temperature distribution. The backlight module utilizes a heat pipe to carry out the heat from the light source quickly and homogenizes the distribution of temperature of the light source.

Backlight module for homogenizing the temperature of a flat panel display device

A lightguide having either a built-in prism sheet or a built-in diffuser sheet is disclosed. The lightguide includes: a prism sheet having a plane surface and a surface with a plurality of patterned microlens; a transparent wedge having a cross-section of trapezoid; and a binder layer sandwiched between said plane surface of said prism sheet and said transparent wedge. A method for manufacturing the lightguide is also disclosed here.

Lightguide and method for manufacturing the same

A method for manufacturing a lens-implanted optical sheet is disclosed, which includes following steps: (A) laying a patterned screen mask on an inner surface of a mold (B) coating or transferring-printing a layer of an adhesive or a binder on said inner surface (C) removing said patterned mask (D) locating said lens or said prisms on said adhesive or said binder (E) closing said mold and injecting a polymer into said mold to form a molded optical sheet; and (F) opening said mold. The lens-implanted optical sheet with a smooth surface and with a simple structure is also revealed here.

Lens-implanted optical sheet and method for manufacturing the same

A heat pipe for transferring heat from a heat source to a heat dissipater. The heat pipe includes a tube encasing a low viscosity working fluid and at least one radially segmented disk to restrict the flow of the working fluid to a single direction around the interior of closed loop of the tube. The tube additionally has a first surface adapted to contact at least a portion of a heat source, and a second surface adapted to contact at least a portion of a heat dissipater. The heat source vaporizes the working fluid, pressure forcing the fluid to circulate throughout the enclosed loop of the tube, the vapor being cooled and re-condensed while near the heat dissipater. Each radially segmented disk includes a plurality of segments designed to introduce turbulence into the fluid flow to increase heat transfer rates.

Growing community of inventors

Taipei, Taiwan

Chen-Hua Liu