Lite-on Technology Corporation

Lite-on Opto Technology (changzhou) Co., Ltd.

Silitek Electronic (guangzhou) Co., Ltd.

Lite-on Electronics (guangzhou) Limited

Silitek Electronic (guangzhou) Go., Ltd.

Lite-on Electronics Corporation

Chen-Hsiu Lin

Yi-Chien Chang

Chia-Hao Wu

Yi-Fei Lee

Meng-Sung Chou

Ming-Kun Weng

Chung-Chan Wu

Tsung-Kang Ying

Kuo-Ming Chiu

Shih-Chung Huang

Yu-Yu Chang

Wen-Hsiang Lin

Chih-Chiang Kao

Tsan-Yu Ho

Shih-Chang Hsu

Chun-Chieh Chang

Chih-Yuan Chen

Yung-Chang Jen

Bo-Jhih Chen

Chung-Hsien Yu

Shih-Chiang Yen

Yu-Chou Lin

Erh-Chan Hsu

Chien-Shun Huang

Pin-Feng Hung

Hung-Yuan Su

Chih-Lung Liang

Yen-Chun Lee

Cheng-Hong Su

Yi-Hsuan Chen

Ming-Sung Tsai

Chiou-Yueh Wang

Cheng-Han Wang

Chih-Li Yu

Cheng-Chung Kuo

Ho-Feng Chiu

Jen-Chun Weng

Tai-Wen Tsai

Hsiu-Tsu Wang

Chien-Lin Chang Chien

Chien-Feng Kao

Hao-Wei Hong

Szu-Tsung Kao

Chun-Wei Huang

Yi Chien Chang

Ya Ting Jhang

Yi-Nan Chen

Wen-Nan Chen

Chang-Yen Lin

Cheng-Ying Lee

Min-Hsi Chen

Shirley Sia

An optical sensing module includes a substrate, an optical sensing device, and a plurality of solders. The substrate has an upper surface, and the upper surface has a plurality of first soldering pads. The optical sensing device is disposed upright on the substrate. The optical sensing device includes a transposition plate and an optical sensing package. The transposition plate includes a first surface, a second surface, and a third surface. The first surface has a plurality of second soldering pads, the second surface has a plurality of conductive through holes, and the third surface has a plurality of metal ribs. The conductive through holes are electrically connected to the second soldering pads and the metal ribs. The optical sensing package is disposed on the first surface and electrically connected to the second soldering pads. The plurality of solders climb onto the plurality of metal ribs, respectively.

Optical sensing module

An optoelectronic package structure and a photo-interrupting device are provided. The photo-interrupting device includes a casing and two optoelectronic package structures oppositely arranged. The optoelectronic package structure includes a housing, a first lead frame, a second lead frame, an optoelectronic element, and a sealing element. The optoelectronic element is disposed on the first lead frame and is electrically connected to the second lead frame through a conducting wire. The housing encapsulates one part of each of the first lead frame and the second lead frame. Another part of each of the first lead frame and the second lead frame correspondingly protrudes from one end of the housing having an opening arranged on a first surface, and the optoelectronic element is exposed through the opening. The sealing element covers the optoelectronic element, and a surface of the sealing element is not higher than the first surface of the housing.

Optoelectronic package structure and photo-interrupting device

A light emitting device includes a circuit substrate, a plurality of light emitting elements, a control element, and a sealing structure. The circuit substrate has a plurality of upper electrical connecting pads at the top thereof and a plurality of testing pads and a plurality of lower electrical connecting pads at the bottom thereof. The light emitting elements are arranged on the circuit substrate. The control element is arranged on the circuit substrate and electrically connected to the light emitting elements. The sealing structure is configured to cover the light emitting elements and the control element, and the testing pads of the circuit substrate are exposed from the sealing structure for testing respective characteristic parameter values of the light emitting elements.

Light emitting device

An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier, a metal member, an insulating layer, an optoelectronic element, and an adhesive. The metal member is disposed on the carrier. The insulating layer is disposed on the metal member. The insulating layer has a plurality of grooves, and a carrying region is defined by the grooves. The optoelectronic element is disposed on the insulating layer. The adhesive is filled into the grooves and bonds the optoelectronic element onto the carrying region of the insulating layer.

Optoelectronic package structure

A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.

Multiple pixel package structure with buried chip and electronic device using the same

A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.

Light-emitting device, light-emitting assembly, and integrated circuit flip-chip

A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.

Package structure with supporting frame

A light-emitting device and a light emitting module are provided. The light emitting module includes a housing, at least one light guide element, and at least one light emitting element. The housing includes at least one passage passing through its a first surface and a second surface, and a coupling portion formed on an inner surface adjacent to the second surface. The light guide element arranged in the at least one passage has a light emergent surface exposed at one end of the at least one passage and a light incident surface exposed at the other end of the at least one passage. The light emitting element is coupled to the housing by the coupling portion. The light emitting element includes a light emitting surface facing to the light incident surface of the light guide element and a soldering portion exposed from the housing.

Light emitting module and light-emitting device having the same

A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.

LED package sturcture

A light emitting device is provided. The light emitting device includes a package structure, a first light emitting chip, a second light emitting chip, a third light emitting chip, a first encapsulant, a second encapsulant, and a third encapsulant. The first light emitting chip, the second light emitting chip, and the third light emitting chip are disposed in a first cavity, a second cavity, and a third cavity of a body of the package structure, and electrically connected with a first electrode pair, a second electrode pair, and a third electrode pair that are covered by the body. The first encapsulant, the second encapsulant, and the third encapsulant are filled in the first cavity, the second cavity, and the third cavity. A first opening of the first cavity is larger in size than a second opening of the second cavity and a third opening of the third cavity.

Light emitting device for monitoring system

A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.

Chip bonding region of a carrier of light emitting package and manufacturing method thereof

A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.

Light-emitting package structure and manufacturing method thereof

A light detecting device, a lighting module, and a manufacturing method for the same are provided. The lighting module includes a carrier, a light assembly having a first lighting unit and a second lighting unit, a lens assembly having a first lens and a second lens, and a casing surrounding the lens assembly. The first lighting unit emits a first beam having a first wavelength through the first lens to define a first view angle and the second lighting unit emits a second beam having a second wavelength through the second lens to define a second view angle. The first wavelength is smaller than the second wavelength, and the first view angle is greater than the second view angle.

Light detecting device, lighting module, and manufacturing method for the same

A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.

Substrate structure with buried chip and light emitting device using the same

A lead frame array for carrying chips includes a plurality of lead frames. Any four lead frames adjacent to each other and have two pairs of linking bridge groups which are connected any two lead frames adjacent to each other by one of the linking bridge groups. Each linking bridge group has an inner linking bridge, a slanted linking bridge and an outer linking bridge. An LED package structure with multiple chips is further provided, which includes a lead frame formed by cutting the lead frame array.

Lead frame array for carrying chips and LED package structure with multiple chips

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Taipei, Taiwan

Chen-Hsiu Lin