Cpumate Inc.

Golden Sun News Techniques Co., Ltd.

Hon Hai Precision Industry Co., Ltd.

Kitagawa Holdings, LLC

Golden Sun New Techniques Co., Ltd.

Chen-Hsiang Lin

Kuo-Len Lin

Chih-Hung Cheng

Ken Hsu

Hwai-Ming Wang

Fang-Ta Tai

Wen-Jung Liu

Teng-Feng Zou

Chiao-Li Huang

Mong-Hua Hung

Jui-Ting Hung

Tien-Chih Tseng

Yi-Bin Hwang

Jen-Fan Sun

Cheng-I Lin

Jui-Ho Liu

Li-Chung Sun

Ju-Tsu Huang

Chih-Hsung Cheng

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold () and a second mold () having different concave cambers (), using the first mold () to progressively compress the heat pipes () and form a camber () at an evaporating section (), using the second mold () to compress the camber () to form a contact plane () and an attaching plane () perpendicular to each other, coating an adhesive () on the contact planes (), connecting the contact planes to make the attaching planes co-planar.

Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith

A power supply system to provide power for a central processing unit (CPU) includes a bridge circuit, a pulse width modulation (PWM) controller and a pulse adjusting driver circuit. The bridge circuit detects a work state of the PWM controller to obtain a feedback signal output from the PWM controller, and provides the feedback signal to the CPU. The CPU outputs a control signal to the bridge circuit according to a work state of the CPU and the feedback signal, and the bridge circuit outputs a PWM signal to the pulse adjusting driver circuit according to the control signal. The pulse adjusting driver circuit receives a first driving signal provided by an external circuit, and adjusts the first driving signal according to the PWM signal to generate at least one second driving signal to drive the CPU.

Selectable phase power supply system

A voltage converter includes a driver, a subsidiary voltage converter, an inductor, a capacitor, and a voltage detection unit. The subsidiary voltage converter generates a driving voltage transmitted to the driver to supply working power to the driver. The driver controls the capacitor to be alternately charged and discharged through the inductor, thereby generating an output voltage and output current between the inductor and the first capacitor. The voltage detection unit detects an electric potential difference of the inductor and generates a reference voltage according to the electric potential difference, and the subsidiary voltage converter receives the reference voltage and adjusts the driving voltage according to the reference voltage.

Voltage converter

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.

Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof

A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Heat sink having heat-dissipating fins capable of increasing heat-dissipating area

A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Heat sink system and heat sinking method having auto switching function

A heat dissipating structure of a lightweight lamp cupmade of a porous material includes a containing cavityat an end of the lamp cup, a lamp holderat another end of the containing cavity, a metal hoodsheathed with the lamp holderand covered onto an external side of the lamp cup, a heat conduction mediumbetween the lamp cupand the metal hood, and a light emitting unitcontained in the containing cavityof the lamp cup, such that the heat produced by the light emitting unitcan be conducted form the lamp cupto the metal hoodand dissipated from the metal hoodto the outside.

Heat dissipating structure of LED lamp cup made of porous material

A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.

Heat-dissipating fin capable of increasing heat-dissipating area

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold () and a second mold () having different concave cambers (), using the first mold () to progressively compress the heat pipes () and form a camber () at an evaporating section (), using the second mold () to compress the camber () to form a contact plane (') and an attaching plane (&#x2032;) perpendicular to each other, coating an adhesive () on the contact planes (&#x2032;), connecting the contact planes to make the attaching planes co-planar.

Method of manufacturing a heat conducting structure having a coplanar heated portion

A cooling rack structure includes a cooling plate (), a temperature conductor (), a centrifugal fan (), a cooling body () and a thermoelectric cooling component (). A temperature-super-conducting component () is disposed on an inner surface () of the cooling plate (). The temperature conductor () is arranged on the temperature-super-conducting component (). In addition, a heat-exhausting hole () is arranged on an upper side of the cooling plate (). The centrifugal fan () is disposed between the temperature conductor () and the heat-exhausting hole () while the cooling body () is disposed between the fan () and the heat-exhausting hole (). A hot side face () of the thermoelectric cooling component () closely contacts the cooling body () while a cold side face () is arranged on the temperature-super-conducting component (). By quickly conducting the low temperature generated from the thermoelectric cooling component () onto the cooling plate () through the temperature-super-conducting component (), a low temperature surface can be uniformly provided to obtain a cooling effect.

Cooling rack structure of thermoelectric cooling type

A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.

Heat sink having heat-dissipating fins of large area and method for manufacturing the same

The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Method for manufacturing large-area heat sink having heat-dissipating fins

A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Method for manufacturing a heat sink

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.

A heat-dissipating device () includes a casing () and a thermal insulation plate () provided within the casing (). The thermal insulating plate () divides the interior of the casing () into a first accommodating space () and a second accommodating space (). A hot air outlet () and a first air inlet () of the casing () are in communication with the first accommodating space (). A cold air outlet () and a second air inlet () of the casing () are in communication with the second accommodating space (). A thermoelectric cooling chip () is disposed in a through-hole () of the thermal insulation plate () and has a hot-end surface () facing the first accommodating space () and a cold-end surface () facing the second accommodating space (). A heat-dissipating module () is received in the first accommodating space (). A cold-airflow supplying module () is received in the second accommodating space (). The heat generated by the hot-end surface () is dissipated to the hot air outlet () by the thermal conduction of the heat-dissipating module (). The cold generated by the cold-end surface () is conducted and distributed uniformly by the cold-airflow supplying module () to the cold air outlet ().

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Wugu, Taiwan

Chen-Hsiang Lin