Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen-Hsi Shih

Dian-Hau Chen

Ching-Tien Ma

Gau-Ming Lu

Cho-Ching Chen

A wet dip method for photoresist and polymer stripping from a wafer surface without the need for a buffer solvent treatment step is disclosed. In the method, the wafer is first exposed to an etchant solution that is maintained at a temperature of at least 80&deg; C. The wafer is then cooled in a room temperature air for a sufficient length of time until the temperature of the wafer reaches substantially room temperature. The wafer is then rinsed in a rinsing step that includes a quick dump rinse and a final rinse with deionized water that is maintained at a temperature not higher than room temperature without first exposing the wafer to a buffer solvent such as that required in a conventional wet dip method.

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Yung Kang, Taiwan

Chen-Hsi Shih