Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen-Fon Chang

Chih-Teng Liao

Chun-Yi Wu

Shi-Yu Ke

Jun Shimada

Chi-Hsing Lin

Methods for revitalizing components of a plasma processing apparatus that includes a sensor for detecting a thickness or roughness of a peeling weakness layer on a protective surface coating of a plasma processing tool and/or for detecting airborne contaminants generated by such peeling weakness layer. The method includes detecting detrimental amounts of peeling weakness layer buildup or airborne concentration of atoms or molecules from the peeling weakness layer, and initiating a revitalization process that bead beats the peeling weakness layer to remove it from the component while maintaining the integrity of the protective surface coating.

Method and apparatus for revitalizing plasma processing tools

An etching apparatus is provided to be able to rotate or tilt a substrate holder on which a to-be-processed substrate is placed. According to a profile of a pre-process critical dimension of the substrate, the etching apparatus may rotate or tilt the substrate holder during an etching process in order to achieve a desired profile of a post-process critical dimension of the substrate that is related to the pre-process critical dimension.

Growing community of inventors

Hsinchu, Taiwan

Chen-Fon Chang