Industrial Technology Research Institute

Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan

Chen-Chung Du

Muh-Wang Liang

Jen-Rong Huang

Chen-Der Tsai

Pang-Ming Chiang

Chih-Chiang Weng

Yi-Chao Weng

Chia-Hao Chang

Jen-Yuan Chang

Jwu-Sheng Hu

Chun-Hsien Liu

Fu-Ching Tung

Chih-Cheng Wang

Meng-Chun Chen

Tean-Mu Shen

Tsann-Huei Chang

Jinn-Fa Wu

Yu-Ming Wang

Shao-Yu Hsu

Sheng-Lang Lee

Chih-Yuan Tseng

Ching-Lin Lin

Jui-Mei Hsu

Te-Hui Yang

Chyi-Liou Lin

Jing-Ching Lin

Brian Luan Chen

Ming-Tung Chiang

Chin-Feng Cheng

Kuo-Hui Yang

Szu-Han Hu

Ying-Fang Chang

Zhi-Ming Chen

Cheng-Chang Lin

A magnetic position detecting device and a method for detecting a magnetic position are provided. An induced voltage is generated by changing a position between a pattern of an inductive ruler and an alternating magnetic field of an exciting element. A position of the exciting element is resolved by a technical means of voltage resolution for positions.

Magnetic position detecting device and method

A plasma device includes a dielectric barrier, a first electrode structure, a second electrode structure, and a third electrode structure. The dielectric barrier has an upstream terminal and a downstream terminal and defines a space, in which the first electrode structure is disposed. A gap with multiple widths is formed between the first electrode structure and the dielectric barrier. The dielectric barrier is located between the first electrode structure and the second electrode structure. The second electrode structure includes electrode blocks sequentially arranged from the upstream terminal to the downstream terminal. The dielectric barrier, the first electrode structure, and the second electrode structure are located on the same side of the third electrode structure located at the downstream terminal. A minimum distance between the electrode blocks and the third electrode structure is not less than a distance between the first electrode structure and the third electrode structure.

Plasma device and operation method of plasma device

A modular electrode device comprises a plurality of main bodies, a first electrode, at least one second electrode, at least one first connecting member and two second connecting members. Each main body has a side edge, an internal chamber and a gas inlet communicative in space between the chamber and the atmosphere. The first electrode is mounted at the side edge of one main body, while the in-serial second electrodes connected to one end of the first electrode are mounted at the side edges of the other main bodies. The main bodies are separated by the parallel third electrodes. The third, the second and the third electrodes are connected to each other. The first connecting member bridges in-serially the first electrode and the neighboring second electrode. The second connecting members are applied to both opposing end of the in-serial combination of the first and the second electrodes.

Modular electrode device

A method for depositing a microcrystalline silicon film is disclosed, including performing an open loop and close loop plasma enhanced deposition process without and with modulating process parameters, respectively. A film is deposited by the open loop plasma enhanced deposition process till a required film crystallinity and then performing a closed loop plasma enhanced deposition process which monitors species plasma spectrum intensities SiH* and H&#x3b1; and modulates process parameters of the plasma enhanced deposition process resulting in the species concentration stabilization which controls the intensities variation of SiH* and H&#x3b1; within an allowed range of a target value for improving film depositing rate.

Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition

The present invention provides a hollow cathode discharging apparatus including a hollow anode electrode, a hollow cathode electrode insulatedly fixed in the hollow anode electrode, a gas distribution pipe fixed in the hollow cathode electrode. The hollow anode electrode and the hollow cathode electrode are formed with anode openings and cathode openings respectively. Defined by the gas distribution pipe and the hollow cathode electrode and along the axis thereof is a spiral pathway winding through the cathode openings, so as to form a plurality of continuous and communicated reaction chambers. The gas distribution pipe is disposed with gas separation apertures communicated and adapted to introduce a reactive gas into the reaction chambers. The communicated reaction chambers enable uniform distribution of the reactive gas and thereby facilitate scale-up of the apparatus in axial. Accordingly, the present invention overcomes drawbacks of the prior art.

Hollow cathode discharging apparatus

A wafer electroplating apparatus with a function of bubble removal includes an electroplating bath main body and a fixing device. The electroplating bath main body has an inlet device, a first de-bubble tank and at least an air hole. The fixing device has a second de-bubble tank and an outer shell. The air hole guides gathering bubbles to an outside of the electroplating bath main body so as to remove bubbles. The fixing device can be put into the first de-bubble tank within the electroplating bath main body to form a de-bubble area and is separated easily therefrom to clean the wafer electroplating apparatus. The electroplating bath main body further includes a baffle for rectifying electroplating solution flow before entering the inlet device.

Wafer electroplating apparatus

The present invention relates to a compress and position apparatus with positioning, orientating functions and providing more uniform pressing force compliantly. The compress and position apparatus comprises a guiding column, a base, a housing, a seat, a annular portion and a pressing plate. The base has a cylinder, a plurality of locating pins and a convex portion. The annular portion has a through hole and a plurality of locating holes. The guiding column and the cylinder are disposed in the housing provided with an opening for the guiding column passing therethrough. The housing is mounted on the base and passed through a through hole of the annular portion and disposed in a cavity of the seat. A plane on the housing abuts a plane on the cavity to prevent the rotation of the housing. The guiding column is combined with the seat. The locating pin is inserted into the locating hole. The pressing plate engages the annular portion. Thus the guiding column is moved up and down by the gas supply device. The convex portion biases the pressing plate to exert force on the substrate.

Compress and position apparatus

A fixed support for voice coil motor comprises a coil, hollow plate, opening, structural reinforcement beam, and a plurality of pins. The pins extruding from the hollow plate allows the coil to wind around them. The opening, which locates on the center of the hollow plate, distributes stress concentration around the center. The structural reinforcement beam, which extrudes from an edge of the hollow plate, improves stiffness of the fixed support, thereby allowing the hollow plate to be made thinner.

Fixed support for voice coil motor

A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.

Solder-ball supplying apparatus

A coolant through spindle device is disclosed, including a rotating joint member secured to the rear end of the spindle for conducting coolant into the spindle, the coolant being conducted through a separate coolant passage inside the spindle to the nozzles formed on a cutting tool to be sprayed out thereof so as to fully cool down and lubricate the cutting point thereof, increase machining precision and cutting rate, and prolong service life of the cutting tool. Moreover, by using a switching collar to provide separated coolant passage and pressurized air passage, no residual coolant can follow the pressurized air jet into the tapper hole of the spindle to contaminate the tapper hole.

Coolant through spindle device

An automatic tool-exchanging device can be set on a robot for exchanging tools. It mainly comprises an upper and lower assemblies, and an engaging mechanism. The engaging mechanism includes a cam, which is to be driven with a double-acting pneumatic cylinder assembly. When the double-acting pneumatic cylinder is turned on, the upper and lower assemblies will be engaged together and generate a self-lock effect for safety; when the double-acting pneumatic cylinder is turned off, the two assemblies will be disengaged from each other.

Automatic tool-exchanging device

Growing community of inventors

Hsinchu, Taiwan

Chen-Chung Du