Industrial Technology Research Institute

Intellectual Property Innovation Corporation

University of Florida Research Foundation, Incorporated

Chen-Chu Tsai

Chih-Chia Chang

Yuh-Zheng Lee

Cheng-Yi Wang

Cheng-Che Wu

Kuo-Lung Lo

Ming-Huan Yang

Kai-Ming Chang

Jui-Chang Chuang

Ting-Hsun Cheng

Shi-Chang Chen

Shin-Tson Wu

Cheng-Chung Lee

Jia-Chong Ho

Wei-Yuan Cheng

Yung-Hui Yeh

Chien-Jung Huang

Heng-Yin Chen

Chao-Kai Cheng

Shu-Wei Kuo

Wan-Wen Chiu

Kun-Lin Chuang

Ko-Chin Yang

Chia-Hao Tsai

Yu-Pei Chang

Yan Li

Kuo-Hua Wu

Kun-Ming Chen

Meizi Jiao

Tzu-Chun Lin

An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Impact resistant structure and electronic device

An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 &#x3bc;m, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.

Device for removing and adhering substrate and method for using the device

A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Flexible electronic module and manufacturing method thereof

A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Package of flexible environmental sensitive electronic device and sealing member

A flexible electronic device including a flexible panel and an auxiliary layer is provided. The flexible panel has a plurality of operation portions, wherein a predetermined bending portion disposed between each adjacent two of the operation portions. The auxiliary layer is disposed on a surface of the flexible panel and at least located above the predetermined bending portion. The predetermined bending portion of the flexible panel may be bent in a first bending state for the auxiliary layer to be in contact with the predetermined bending portion, and a radius of curvature of the auxiliary layer is greater than a radius of curvature of the predetermined bending portion. The flexible electronic device has a first compressive stress region and a first tensile stress region, and a range of the first compressive stress region is greater than a range of the first tensile stress region.

Flexible electronic device

According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Flexible electronic device and method for manufacturing the same

According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Electronic device package, electronic device structure and method of fabricating electronic device package

According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.

Flexible device and fabrication method of flexible device

A camouflage structure, capable of altering its appearance, comprises a camouflage graphic layer and a color-changing layer disposed on the camouflage graphic layer. Originally, the camouflage structure presents a first color state. After the color-changing layer changes the color by driving methods, the camouflage structure presents a second color state. For example, a transparent or semi-transparent color-changing layer able to reflect or emitting red light could be disposed on the woodland camouflage graphic layer, which allows for the overall appearance to change from the greenish woodland camouflage to the brownish desert camouflage. Alternatively, the camouflage structure could comprise a greenish camouflage graphic layer made of material with red-shift characteristics, which means the greenish camouflage graphic layer consists of different colors of chromic materials with reversible red-shift characteristics. The greenish camouflage graphic layer can be red-shifted by driving methods so as to present an appearance of brownish desert camouflage.

Camouflage structure capable of altering its appearance

A display device includes a first substrate, at least a first protrusion, a first electrode, a second substrate, at least a second protrusion, a second electrode and a display medium. The first protrusion is disposed on the first substrate. The first electrode is disposed on the first protrusion. The second substrate is disposed opposite to the first substrate. The second protrusion is disposed on the second substrate. The second electrode is disposed on the second protrusion, wherein the first electrode and the second electrode are displaced in a horizontal direction so as to form a lateral electric field therebetween. The display medium is sandwiched between the first and the second substrates.

Display device

A supply system capable of providing a working fluid is provided. The supply system includes an access device, a first energizer, a second energizer, a third energizer and an output device. The access device utilized to access the working fluid includes a connecting port. The first energizer provides a first energy to energize the working fluid, thereby expelling the bubbles from the working fluid. The second energizer provides a second energy to energize the working fluid received in the access device, thereby expelling the working fluid through the connecting port of the access device. The output device is connected to the access device, thereby receiving and outputting the working fluid. The third energizer provides a third energy to heat the working fluid passing through the access device and the output device.

Growing community of inventors

Taichung, Taiwan

Chen-Chu Tsai