Egis Technology Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Lightuning Tech. Inc.

J-metrics Technology Co., Ltd.

Chen-Chih Fan

Bruce C S Chou

Tong-Long Fu

Yu-Hsiang Huang

Jung-Kuo Tu

Wallace Y W Cheng

Chang-Chia Chang

Wei-Ting Lin

Yang-Che Chen

Jer-Wei Chang

Yung-Fu Chen

Shih-Chun Kuo

Chun-Ching Tseng

Chingfu Tsou

Chun-Feng Kao

Wei-Jung Wang

Chih-Hsien Yeh

A light sensing module including a photodiode array substrate, a distance increasing layer, and a light converging element array is provided. The photodiode array substrate includes a plurality of light sensing units arranged in an array and a circuit region. The circuit region is disposed on the periphery of the light sensing units. Each of the light sensing units includes a plurality of adjacent photodiodes arranged in an array. The distance increasing layer is disposed on the photodiode array substrate. The light converging element array is disposed on the distance increasing layer, and includes a plurality of light converging units arranged in an array. Reflected light from an outside is converged by the light converging elements on the light sensing units, respectively.

Light sensing module

An electronic device using an under-display fingerprint identification technology and a waking method of the electronic device are provided. The electronic device includes a display panel, a central processing unit and a fingerprint sensing module. The electronic device executes an operating system. When the central processing unit and the operating system are in a power-saving mode, the fingerprint sensing module enters a default operation mode and the display panel enters an always-on display mode. Then, the fingerprint sensing module senses a specified region of the display panel to acquire a first image. If the content of the first image contains an image of a finger, the fingerprint sensing module issues an interrupt signal to the central processing unit. Consequently, the central processing unit is woken up from the power-saving mode and the operating system is woken up.

Electronic device using under-display fingerprint identification technology and waking method thereof

A manufacturing method of a sensing module for an optical fingerprint sensor is provided. A plurality of photo detectors are formed in a light sensing layer. The photo detectors are arranged in a sensing array. A plurality of collimators are formed in a light filter layer. The collimators are divided into a plurality of collimator groups corresponding to the photo detectors. The collimator groups are arranged in a collimator group array. The light sensing layer is attached to the light filter layer so that the light filter layer is disposed on the light sensing layer and the collimator group array of the light filter layer is aligned with the sensing array of the light sensing layer. Each of the collimator groups corresponds to one of the photo detectors, and aligned with and disposed above the corresponding photo detector. Each of the collimator groups comprises the same number of collimators arranged in a specific pattern.

Manufacturing method of sensing module for optical fingerprint sensor

An optical fingerprint sensing module for sensing a fingerprint pattern of a finger placed on an upper surface of a display panel module is provided, wherein light is generated by the display panel module and reflected by the finger. The optical fingerprint sensing module includes a substrate, an image sensor disposed above the substrate, a collimating layer disposed above the image sensor, a light permeable layer disposed above the collimating layer, and a pinhole layer disposed above the light permeable layer. The collimating layer has a plurality of collimating holes, and the pinhole layer has a plurality of pinholes, wherein the number of collimating holes is greater than the number of pinholes. Light is reflected by the finger and then sequentially propagates through the pinholes, the light permeable layer, and the collimating holes to reach the image sensor.

Optical fingerprint sensing module

An optical fingerprint sensing module for sensing a fingerprint pattern of a finger is provided, wherein the finger is placed on a display panel module, and light is generated by the display panel module and reflected by the finger. The optical fingerprint sensing module includes a circuit board, an image sensor on the circuit board, a frame on the circuit board, a lens embedded in the frame, and an IR filter disposed above the image sensor. The image sensor is located in the frame, and the frame includes anti-infrared material. The lens corresponds to a sensing area of the display panel module. Light emitted from the display panel module is reflected by the finger located in the sensing area and then sequentially propagates through the lens and the IR filter to reach the image sensor.

An optical fingerprint sensor is provided. The optical fingerprint sensor includes a sensing module. The sensing module includes a light sensing layer and a light filter layer disposed above the light sensing layer. The light sensing layer includes a plurality of photo detectors arranged in a sensing array. The light filter layer includes a plurality of collimators. The collimators are divided into a plurality of collimator groups corresponding to the photo detectors, and the number of collimator groups is equal to the number of photo detectors. Each of the collimator groups comprises the same number of collimators arranged in a specific pattern and disposed above the corresponding photo detector. The photo detectors receive reflected light from a user's finger through the collimators of the corresponding collimator groups.

Optical fingerprint sensor and manufacturing method of sensing module thereof

A fingerprint identification system, comprising panel, for placing finger; light source, disposed under panel, for generating incident light, wherein incident light is emitted to and reflected by finger to generate reflected light; processor, for performing fingerprint identification on finger according to plurality of sensing signals; and optical sensing array, disposed under panel and coupled to processor, comprising plurality of sensing units for generating plurality of sensing signals, each of sensing units comprising optical sensor, for receiving reflected light reflected by finger to generate sensing signal; focusing layer, disposed under panel, for focusing reflected light reflected by finger; blocking layer, disposed under focusing layer, for blocking part of reflected light to reduce diffraction phenomenon of reflected light; shading layer, disposed under blocking layer, for blocking part of reflected light to limit incident angle of reflected light; and aperture layer, disposed under shading layer and on optical sensor, for blocking stray light.

Fingerprint identification system, sensing method and manufacturing method

A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.

MEMS device structure and methods of forming same

A method includes placing a microelectromechanical system (MEMS) device over a carrier, wire bonding the MEMS device to a bond pad on the carrier with a bond wire, and spray coating a buffer layer over the MEMS device and enclosing the bond wire. A Young's modulus value of the buffer layer is less than a Young's modulus value of the MEMS device.

Method of protecting microelectro mechanical system device

A fingerprint identification device includes a first dielectric layer, a fingerprint sensing chip, a packaging layer, a first redistribution layer, a second dielectric layer, a second redistribution layer, and a third dielectric layer. The fingerprint sensing chip is disposed on the first dielectric layer and has a sensing transmission pad. The packaging layer defines a first via hole and covers the first dielectric layer and fingerprint sensing chip. Disposed on the packaging layer, the first redistribution layer contacts a drive transmission pad via the first via hole. The second dielectric layer defines a second via hole and covers the packaging layer and the first redistribution layer. Disposed on the second dielectric layer, the second redistribution layer defines a looped pattern, in addition to connect electrically with the first redistribution layer via the second via hole. The third dielectric layer covers the second dielectric layer and second redistribution layer.

Fingerprint identification device

A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.

Capacitive sensors and methods for forming the same

Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS sensor over the substrate. The MEMS sensor includes a floating heater disposed over the substrate. The MEMS sensor further includes a heat sink disposed over the substrate and at a side of the floating heater, and the heat sink has an air gap with the floating heater. The MEMS sensor further includes a first plurality of vias formed through the heat sink and thermally connected to the first substrate.

Mechanisms for forming micro-electro mechanical device

A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.

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Taipei, Taiwan

Chen-Chih Fan