Taiwan Semiconductor Manufacturing Comp. Ltd.

Chen Chiang Yu

Szu-Wei Lu

Tsung-Fu Tsai

A semiconductor package including a cooling system and a method of forming are provided. The semiconductor package may include an interposer, one or more package components bonded to the interposer, an encapsulant on the interposer, and a cooling system over the one or more package components. The cooling system may include one or more metal layers on top surfaces of the one or more package components, first metal pins on the one or more metal layers, second metal pins, wherein each of the second metal pins may be bonded to a corresponding one of the first metal pins by solder, and a first lid over the second metal pins, wherein the first lid may include openings.

Growing community of inventors

Taoyuan, Taiwan

Chen Chiang Yu