Cisco Technology, Inc.

Chejung Liu

Vic Hong Chia

Ravinandana Mysore Ramachandra Rao

George Edward Curtis

Marcus C Chan

Allison T Yuan

Hayden W Farriester

Elias Khamisy

A flow rate adapter includes an enclosure defining an interior, a first partition separating the interior into first and second chambers, a second partition separating the interior into third and fourth chambers, and a flexible diaphragm separating the second and third chambers. Each chamber is fluidly isolated from one another. The second and third chambers are positioned between the first and fourth chambers with the second chamber being positioned adjacent to the first chamber and the third chamber being positioned adjacent to the fourth chamber. The second and third chambers are positioned adjacent to one another. The flow rate adapter includes a gate coupled with the flexible diaphragm. A temperature gradient between working fluid flowing through the first and fourth chambers causes the flexible diaphragm to flex, which moves the gate within the fourth chamber to control the flow rate of the working fluid.

On-demand flow rate adapter for flow rate adjustment in liquid cooling solutions

A fan guard that includes an array of openings disposed adjacent to one another along a plane to enable flow of air directed transverse to the plane, segments that each include a face extending along the plane and a thickness extending transverse to the plane, and flanges connected to the segments to cooperatively form the array of openings. Each flange includes a depth extending transverse to the plane, the depth being greater than the thickness of each segment of the plurality of segments.

Fan guard for fan

Providing cooling airflow through an electronic device is described. The electronic device incudes a heat source, an airflow enclosure, an insulation layer, and a directional structure. The airflow enclosure is on a first side of the insulation layer and the heat source is on a second side of the insulation layer. The insulation layer includes at least one directional opening that is adjacent to the heat source. The directional structure is positioned on the second side of the insulation to provide a directed cooling airflow path from the at least one directional opening to the heat source.

Directed cooling in heat producing systems

A dynamic air baffle comprises: spaced-apart first and second plates configured to be positioned adjacent to at least one heat source to be cooled by an airflow; a heat insulator sandwiched between the first and second plates; and an air flap coupled to the first and second plates and extending into the airflow; wherein the first and second plates are configured such that a differential temperature between the first and second plates causes a differential expansion in lengths of the first and second plates, which rotates the air flap from a rest position, corresponding to when the differential temperature is zero, to a rotated position that is closer to a cooler plate and farther from a hotter plate of the first and second plates, such that the air flap directs more of the airflow to the hotter plate and less of the airflow to the cooler plate.

Intelligent dynamic air baffle

According to one embodiment, an apparatus is provided that includes a first block and a second block, one or more springs provided between the first block and the second block, and a thermally conductive wrap extending from the first block to the second block, wherein the thermally conductive wrap is configured to conduct heat away from the first block. An assembly including a chassis, a receptacle, and the apparatus is also provided, as well as a method for operating the apparatus.

Compressible thermal link

An apparatus comprising a printed circuit board with at least one heat source, an enclosure around the printed circuit board, wherein the enclosure includes a first surface and a second surface opposite the first surface, and a heatsink comprising a body portion and a plurality of fins extending from the body portion, wherein the heatsink is attached to the first surface, and wherein the at least one heat source conducts heat to the heatsink, wherein a plurality of channels are provided between the first surface and the second surface, each of the plurality of channel passing through the enclosure, the heatsink, and the printed circuit board.

Growing community of inventors

San Jose, CA, United States of America

Chejung Liu