Taiwan Semiconductor Manufacturing Comp. Ltd.

National Taiwan University

National Science Council

Cheewee Liu

I-Hsieh Wong

Fang-Liang Lu

Chi-Wen Liu

Samuel C Pan

Shih-Hsien Huang

Shih-Ya Lin

Chung-En Tsai

Hung-Yu Yeh

Huang-Siang Lan

Min-Hung Lee

Ya-Jui Tsou

Zong-You Luo

I-Chen Lin

I-Cheng Tung

A semiconductor device includes a first layer that includes a first semiconductor material disposed on a semiconductor substrate, and a second layer of a second semiconductor material disposed on the first layer. The semiconductor substrate includes Si. The first semiconductor material and the second semiconductor material are different. The second semiconductor material is formed of an alloy including a first element and Sn. A surface region of an end portion of the second layer at both ends of the second layer has a higher concentration of Sn than an internal region of the end portion of the second layer. The surface region surrounds the internal region.

Semiconductor device and manufacturing method thereof

A semiconductor device includes a fin extending along a first direction over a substrate, and a gate structure extending in a second direction overlying the fin. The gate structure includes a gate dielectric layer overlying the fin, a gate electrode overlying the gate dielectric layer, and insulating gate sidewalls on opposing lateral surfaces of the gate electrode extending along the second direction. A source/drain region is formed in the fin in a region adjacent the gate electrode structure, and a stressor layer is between the source/drain region and the semiconductor substrate. The stressor layer includes GeSn or SiGeSn containing 10atoms cmor less of a dopant, and a portion of the fin under the gate structure is a channel region.

Semiconductor device and method of manufacturing thereof

The disclosure is directed to spin-orbit torque MRAM structures and methods. A SOT channel of the SOT-MRAM includes multiple heavy metal layers and one or more dielectric dusting layers each sandwiched between two adjacent heavy metal layers. The dielectric dusting layers each include discrete molecules or discrete molecule clusters of a dielectric material scattered in or adjacent to an interface between two adjacent heavy metal layers.

Magnetic tunnel junction structures and related methods

A semiconductor device includes a first layer of a first semiconductor material disposed on a semiconductor substrate and a second layer of a second semiconductor material disposed on the first layer. The second semiconductor material is formed of an alloy that includes a first element and a second element. The first semiconductor material and the second semiconductor material are different. A gate structure is disposed on a first portion of the second layer. A surface region of a second portion of the second layer not covered by the gate structure has a higher concentration of the second element than an internal region of the second portion of the second layer, and the surface region surrounds the internal region.

A method of manufacturing a semiconductor device includes forming an alloy semiconductor material layer comprising a first element and a second element on a semiconductor substrate. A mask is formed on the alloy semiconductor material layer to provide a masked portion and an unmasked portion of the alloy semiconductor material layer. The unmasked portion of the alloy semiconductor material layer not covered by the mask is irradiated with radiation from a radiation source to transform the alloy semiconductor material layer so that a surface region of the unmasked portion of the alloy semiconductor material layer has a higher concentration of the second element than an internal region of the unmasked portion of the alloy semiconductor material layer. The surface region surrounds the internal region.

Semiconductor device having stressor layer

In a method of fabricating a field effect transistor, a fin structure made of a first semiconductor material is formed so that the fin structure protrudes from an isolation insulating layer disposed over a substrate. A gate structure is formed over a part of the fin structure, thereby defining a channel region, a source region and a drain region in the fin structure. After the gate structure is formed, laser annealing is performed on the fin structure.

Semiconductor device including field effect transistor and a method for fabricating the same

Disclosed is a photodetector adapted to be used with a voltage source for replacing the conventional CCD. The photodetector includes a substrate electrically connected with an electrode of the voltage source for generating electron-hole pairs in response to a light, a conducting layer electrically connected with the other electrode of the voltage source, and an ultra thin (&tilde;nm) insulating layer formed between the conducting layer and the substrate, wherein one of electrons and holes, excited by the light, in the substrate will move to the conducting layer through the insulating layer so as to form a photo current when the voltage source provides a bias voltage.

Growing community of inventors

Taipei, Taiwan

Cheewee Liu