Western Digital Technologies, Inc.

Sandisk Technologies Inc.

CheeKeong Chin

Junrong Yan

Chin-Tien Chiu

Cong Zhang

Weili Wang

Xin Lu

Xiaofeng Di

Zhonghua Qian

Xianlu Cui

Qi Deng

Chaur Yang Ng

Chenlin Yang

A semiconductor device package includes a mechanical support structure that provides mechanical support to a stack of dies, where the dies are laterally offset from each other. The support structure has a sloped surface that is disposed at a non-perpendicular and non-parallel angle to other surfaces of the mechanical support structure. Electrical contacts are disposed on the sloped surface of the mechanical support structure for electrically interfacing with the stacked dies and on a different surface of the mechanical support structure for electrically interfacing with a substrate.

Sloped interconnector for stacked die package

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Semiconductor device including vertical wire bonds

Growing community of inventors

Shanghai, China

CheeKeong Chin