Heraeus Materials Singapore Pte. Ltd.

Chee Wei Tok

Murali Sarangapani

Xi Zhang

Il Tae Kang

Senthil Kumar Balasubramanian

Suat Teng Tan

Jurgen Scharf

Yean Mee Pun

Jin Zhi Liao

Kim Hui Chong

Tae Yeop James Kim

Yee Weon Lim

Dan Su

Abito Danila Bayaras

Sylvia Sutiono

A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 &#x3bc;m to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.

Process for electrically connecting contact surfaces of electronic components

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of:

Coated wire

Growing community of inventors

Singapore, Singapore

Chee Wei Tok