Infineon Technologies Ag

Chee Soon Law

Ralf Otremba

Xaver Schloegel

Khai Huat Jeffrey Low

Fong Lim

Zakaria Abdullah

A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

Module comprising a semiconductor chip

A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a ribbon. The ribbon includes a first metal layer and a second metal layer. The first metal layer is welded to the first chip and the second metal layer is attached to the second chip.

Growing community of inventors

Melaka, Malaysia

Chee Soon Law