Growing community of inventors

Singapore, Singapore

Chee Lip Gan

Average Co-Inventor Count = 4.24

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1

Chee Lip GanAlfred A Zinn (6 patents)Chee Lip GanYeng Ming Lam (4 patents)Chee Lip GanByung Hoon Lee (4 patents)Chee Lip GanMei Zhen Ng (2 patents)Chee Lip GanZhenggang Li (2 patents)Chee Lip GanJaewon Kim (2 patents)Chee Lip GanChristopher Allan Schuh (1 patent)Chee Lip GanZehui Du (1 patent)Chee Lip GanHang Yu (1 patent)Chee Lip GanChee Lip Gan (7 patents)Alfred A ZinnAlfred A Zinn (49 patents)Yeng Ming LamYeng Ming Lam (6 patents)Byung Hoon LeeByung Hoon Lee (4 patents)Mei Zhen NgMei Zhen Ng (3 patents)Zhenggang LiZhenggang Li (2 patents)Jaewon KimJaewon Kim (2 patents)Christopher Allan SchuhChristopher Allan Schuh (48 patents)Zehui DuZehui Du (2 patents)Hang YuHang Yu (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Kuprion Inc. (4 from 16 patents)

2. Nanyang Technological University (3 from 627 patents)

3. Lockheed Martin Corporation (2 from 5,259 patents)

4. Massachusetts Institute of Technology (1 from 8,369 patents)


7 patents:

1. 12091567 - Ink composition, method for forming a conductive member, and conductive device

2. 11417441 - Method of interconnecting nanowires, nanowire network and transparent conductive electrode

3. 11274224 - Ink composition, method for forming a conductive member, and conductive device

4. 10696599 - Shape memory ceramic particles and structures formed thereof

5. 10692621 - Method of interconnecting nanowires and transparent conductive electrode

6. 10202512 - Conductive paste, method for forming an interconnection and electrical device

7. 9976042 - Conductive paste, method for forming an interconnection and electrical device

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
12/6/2025
Loading…