Mediatek Corporation

Chee-Kong Ung

Chun-Wei Chang

Tzu-Hung Lin

Jia-Wei Fang

Ching-Chih Li

Chun-Neng Liao

Li-Chun Yang

Yu-Sung Chen

Meng-Hsin Chiang

Ming-Tse Dai

Chao-Yang Yeh

Chia-Tao Hsu

A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.

Semiconductor integrated circuit device

A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

Power management circuit and associated power management method

A microelectronic package includes a packaging substrate having a chip mounting surface; a chip mounted on the chip mounting surface of the packaging substrate with the chip's active surface facing down to the chip mounting surface; a plurality of input/output (I/O) pads distributed on the active surface of the chip; and a discrete passive element mounted on the active surface of the chip. The discrete passive element may be a decoupling capacitor, a resistor, or an inductor.

Microelectronic package with surface mounted passive element

Growing community of inventors

Hsinchu, Taiwan

Chee-Kong Ung