Infineon Technologies Ag

Chee Hoe Mak

Norliza Morban

Ryan Ross Alinea

Yun Yann Ng

A universal lead frame for semiconductor packages includes a solid lead frame sheet comprising an electrically conductive material and a plurality of columns etched into the lead frame sheet and distributed with a predetermined lead pitch so that the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side. A method of manufacturing the universal lead frame includes providing a solid lead frame sheet of an electrically conductive material and etching a plurality of columns into the lead frame sheet so that the columns are distributed with a predetermined lead pitch and the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side. A method of manufacturing molded semiconductor packages using the universal lead frame is also provided.

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Durian Tunggal, Malaysia

Chee Hoe Mak