Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Chee Heng Wong

Yufeng Yao

Chi Boon Ong

Sze Ping Ong

Han Kang Chong

Fun Kok Chow

Rani Ramamoorthy Saravanan

Kwee Chong Chang

Peng Siang Seet

Dengpeng Chen

Jia Peng

Hui Fung Sim

Yu Feng Yao

An isolation device having first and second semiconductor is disclosed. The first semiconductor die may be adapted to transmit a first signal to the second semiconductor die that is electrically isolated. The first semiconductor die may have a transmitter coupled to a modulator that modulates the first signal. The second semiconductor die may have a receiver having a counter and a control circuit. The control circuit may be adapted to determine an indication of the first signal by using the counter. In addition, an isolation system and a DC-DC feedback regulation control system having such control circuit are disclosed. Likewise, a method for conveying a first signal across an isolation barrier is disclosed. The method may comprise counting a received signal based on internal clock and determining an indication of the first signal from the counter's count value.

Isolation device and system

An isolation device having first and second semiconductor is disclosed. The first semiconductor die may be adapted to transmit a first signal to the second semiconductor die that is electrically isolated. The first semiconductor die may comprise input terminals, a bitstream encoding circuit, a self-synchronizing encoding circuit and a transmitter. The second semiconductor die may comprise a receiver, a self-synchronizing decoder, a bitstream decoding circuit and an optional digital filter. The bitstream encoding and decoding may enable a plurality of signals to be encoded and transmitted through an isolation material.

Coding and decoding isolation device and method thereof

A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing.

Package-on-package proximity sensor module

A proximity sensor with multi-directional movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The multi-directional proximity sensor may have a first proximity sensor with at least one side surface and a second proximity sensor connected to the first proximity sensor configured to detect object movement over a plane substantially parallel to the at least one side surface of the first proximity sensor. The multi-directional movement detection proximity sensor may include a PCB, in which more than one proximity sensor may be disposed on the PCB and operatively integrated to detect multi-directional movement.

Multi-directional proximity sensor

Various embodiments of an ambient light sensor configured to determine the direction of a beam of light incident thereon are disclosed. In one embodiment, an ambient light sensor is provided that comprises a plurality of light detectors arranged in a spatial array upon a light sensing surface. Each of the light detectors in the array is configured to generate an analog output voltage in response to the beam of ambient light falling thereon. The amount of light incident on the individual light detectors in the spatial array varies according to the position of each such sensor with respect to direction of the beam of ambient light. An analog-to-digital converter (ADC) is operably coupled to the plurality of light detectors and is configured to receive the analog output signals generated thereby as inputs thereto, and to provide digital output values representative of the analog signals. Control logic circuitry is operably coupled to the ADC and configured to receive the digital output values therefrom, and is further configured to process such digital output values to determine the direction of the beam of light incident upon the spatial array.

Ambient light sensor configured to determine the direction of a beam of ambient light incident thereon

A proximity sensor with movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The proximity sensor may have a compact size package, wherein the photo detector may be stacked on the ASIC chip and disposed at a substantially equal distance from the at least three light sources. The proximity sensor includes a driver operable to generate a current to a plurality of light sources in a particular timing sequence, a photo detector configured to receive light and generate an output signal, an ASIC configured to report the movement of an object near the proximity sensor if the output signal pattern generated matches one of the output signal patterns from among a set of known output signal patterns. The proximity sensor may be configured to be used as a counter or an on/off switch based on particular movements detected.

Proximity sensor with motion detection

An optical proximity sensor and corresponding methods of measuring crosstalk in the sensor are disclosed. The amount of crosstalk generated between the light emitter and the light detector of an optical proximity sensor is measured and quantified according to one of two methods. The measured crosstalk may then be stored in a register or memory location and then subtracted from signals representative of signals indicative of the nearby presence of an object to be detected combined with crosstalk, thereby removing so the contribution or effect of crosstalk on such signals.

Methods, systems and devices for crosstalk measurement and cancellation in optical proximity sensors

A sensor for measuring the properties of light from a light source is disclosed. The sensor includes first and second photodetectors that are illuminated by the light. The first and second photodetectors generate first and second photodetector signals indicative of the first and second weighted averages of the intensity of light in a wavelength band between 400 nm and 700 nm. The first photodiode is more sensitive to light having wavelengths between 400 nm and 500 nm than the second photodetector. The sensor also includes a color temperature processing circuit that generates a first processed signal that is related to a ratio of the first and second signals. The color temperature processing circuit could include first and second logarithmic amplifiers that generate first and second logarithmic signals, respectively, from the first and second photodetector signals and a subtraction circuit that forms a signal indicative of the difference between the first and second logarithmic signals.

Growing community of inventors

Singapore, Singapore

Chee Heng Wong