MIT Semiconductor (tian Jin) Co., Ltd

Chee Chye Lee

Kok Weng Wong

Jun Kang Ng

Albert Archwamety

Albert Archmawety

The invention includes a system and method for obtaining high-resolution 3D images of objects. The system includes three cameras and three light sources that have different wavelengths (e.g. a red light source, a blue light source and a green light source). Each camera simultaneously captures a color image of the object. A processor separates each of the red light images, the blue light images and the green light images into separate monochrome images using each of the red light source, blue light source and green light source. The quality of the images are not subject to limited resolution of conventional RBG images. Because three different wavelengths of light are used, the surface can be accurately imaged, regardless of its characteristics (e.g. reflectivity and transparency). The system is well suited for industrial uses that require a high volume of objects, particularly those of mixed material, to be rapidly inspected for defects as small as a few microns.

System and method of object inspection using multispectral 3D laser scanning

The present invention includes a system and method for obtaining high-resolution images of objects such as electrical components. The system includes a monochrome camera and three light sources of different wavelengths (e.g. a red light source, a blue light source and a green light source). The camera successively captures a red light image, a blue light image and a green light image of the object. A processor combines the red light image, the blue light image and the green light image into a single high-resolution true color image. Because each image is obtained from an independent light source, the resolution is not limited by the Bayer (RGB) color model. The system is well suited for materials composed of different materials that may react differently to light sources based on its wavelength.

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Singapore, Singapore

Chee Chye Lee