Vlsi Technology, Inc.

Che-Yuan Chen

Sang S Lee

Methods and apparatuses for encapsulating thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks so as to prevent the formation of pinholes and IC warpage without adding bulk or additional structures. The assemblies are repositioned, through offset in the bonding fingers of the leadframe, so that the rates of mold flow in the two halves of the mold cavity are substantially balanced. The repositioning of the assemblies also substantially balances the amount of mold material in the mold halves to prevent warpage when the IC cools down.

Methods and apparatus for manufacturing encapsulated integrated circuits

Encapsulated thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks are disclosed. The integrated circuit assemblies are configured to prevent the formation of pinholes and IC package warpage without adding bulk or additional structures. The assemblies are repositioned, through an offset in the bonding fingers of the leadframe, so that the rates of mold flow in the two halves of the mold cavity are substantially balanced. The repositioning of the assemblies also substantially balances the amount of mold material in the mold halves, which prevents warpage in a finished IC package.

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San Jose, CA, United States of America

Che-Yuan Chen