High Connection Density Inc.

Cornell Research Foundation Inc.

Rainbow Displays, Inc.

Che-yu Li & Company, LLC

Other

Digital Equipment Corporation

Montara Technologies LLC

Che-Yu Li

Zhineng Fan

Ai D Le

Donald P Seraphim

J Peter Krusius

Sharon Laura Moriarty

Dirk Dewar Brown

Matti A Korhonen

Raymond G Greene

Robert Babuka

John P Koons

Thomas L Sly

Weimin Shi

David A Lysack

Linh Van

Robert H Katyl

Boris Yost

Hassan O Ali

John B Dion

Brian David Harry

Douglas E Cote

John J Kresse

Peter Borgesen

Ray G Greene

Zineng Fan

A relay including a coil or solenoid, at least one fixed substrate and a moving substrate, a plurality of braided electrical contact element contacts making contact with pads on the fixed and moving substrates, returning springs mounted on alignment pins, and an optional cover for hermetical sealing. A further embodiment presents a horizontally-moving armature actuated by one or more solenoids.

Braided electrical contact element based relay

A connector system is provided including a housing defining a plurality of through openings. A plurality of electrical contact assemblies, each including at least one torsion spring supported upon a conductive mandrel are arranged so that one electrical contact assembly is positioned within a corresponding one through opening such that each of the mandrels is lodged within a respective one of the through openings with portions of the torsion springs standing proud of the housing.

Electrical contact assembly and connector system

A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive metal or contains thermally conductive metal to provide heat-spreading or dissipation functions in addition to the function of the retention and alignment of the electrical contacts. The above interposer is used for chip attach for a single chip or a stack of chips in the package. The interposer provides electrical connections through individual electrical contact to another chip or to the substrate of the package. It provides also the heat spreading or dissipation function to the chips connected thermally to a particular interposer. The interposer can further be connected thermally to an external heat spreader when necessary.

High density electronic packages

An electrical contact formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. A connector system having a housing that has a plurality of through openings. A plurality of electrical contacts, each being formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. Each of the electrical contacts is arranged within a corresponding one of the plurality of through openings such that the first contact edge is positioned outside of the through-opening in which electrical contact is positioned, and the second contact edge is positioned outside of the through-opening in which electrical contact is positioned, but spaced from the first contact edge.

Electrical contact and connector system

A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with an electrical contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the electrical contact is spaced away from the at least one of the conductive pads, and a second position where the electrical contact electrically engages one of the conductive pads.

Interconnection device and system

An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure. The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact. An electrical contact may also be formed by folding a portion of the unitary structure so as to form one or more pleats, annealing the pleated unitary structure, and then cutting the pleated unitary structure so as to release one or more electrical contacts. The precursor material may also be formed by photo-etching a sheet of conductive material so as to form a mesh, and then annealing the mesh. A connector system may be formed including a housing defining a plurality of openings that are each filled with an electrical contact comprising a plurality of interlaced and annealed wires that have been previously either rolled or pleated.

Electrical contact

An electrical contact () and method of making the electrical contact (), and a connector () and method making the connector (), wherein the electrical contact () is an electrically conducting, interlaced mesh (), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (), wherein the mesh () is annealed while restrained in the form of the electrical contact () wherein the mesh () is free of internal elastic strain, or the mesh () is hardened, and wherein the connector () retains the electrical contact () for edgewise connection.

Electrical contact and connector and method of manufacture

A connector system including first housing having a first header, the first header including one or more conductive pads that are in electrical communication with a conductor. A second housing that is mateable with the first housing and includes a second header positioned on a mating face. The second header includes one or more conductive pad that are electrically engaged with a conductor and positioned in confronting relation with the one or more conductive pads of the first header. An interposer located between the first header and the second header, with a woven contact that extends continuously through the interposer toward conductive pads on the first and second headers. The interposer is movable between a first position where the woven contact is spaced away from the at least one of the conductive pads, and a second position where woven contact electrically engages one of the conductive pads.

An electrical contact () and method of making the electrical contact (), and a connector () and method making the connector (), wherein the electrical contact () is an electrically conducting, nonwoven mesh (), with edges of the mesh providing multiple contact points for edgewise electrical connection of the electrical contact (), wherein the mesh () is annealed while restrained in the form of the electrical contact () wherein the mesh () is free of internal elastic strain, and wherein the connector () retains the electrical contact () for edgewise connection.

An electrical contact having transmission-coil sections with at least two tightly wound turns. Active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide electrical signal communication between the two transmission-coil sections, and spring characteristics. The transmission-coil sections are over coated with a conductive noble metal so as to fuse each of the tightly wound turns together to thereby provide for a shortened electrical transmission pathway through the electrical contact. An LGA interposer for providing data communication between a first and a second array of contact pads is also provided having a dielectric housing with an array of cavities; and a plurality of electrical contacts positioned within the cavities.

Low inductance electrical contacts and LGA connector system

A method for cutting an elastomer cable into ultra-precise, defect-free segments of consistent length, and an apparatus to perform the same. The invented apparatus comprises cable advancement, cable clamping and cable shearing systems. The cable advancement system comprises rollers with a groove substantially matching the diameter of the cable. The cable clamping system comprises a pair of dies with a preferably conical feed hole and a clamping hole substantially matching the diameter of the cable. The cable shearing system comprises a preferably extra keen coated cryo treated movable razor blade that is held at an adjustable angle against the face of the clamping dies and slides in a linear path at a low sawing angle. In one embodiment, a second razor blade for nicking the cable prior to shearing&mdash;on substantially the opposite side of the cable from where shearing begins&mdash;is used to prevent tears in cable slices. The invented apparatus can be manually operated, or it can be motorized.

Precision cutter for elastomeric cable

An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

High-reliability interposer for low cost and high reliability applications

An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Test and burn-in connector

A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.

Coaxial elastomeric connector system

The present invention provides a heat spreading connector suitable for use with electronic components including those using land grid arrays and pin grid arrays and a method for its use. The connector of the present invention includes at least one dielectric layer and at least one thermally conductive layer.

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Ithaca, NY, United States of America

Che-Yu Li