Ichia Technologies, Inc.

Ichia Technoligies, Inc.

Che-Tung Wu

Chih-Ho Hsu

Kai-Jie Tsao

Chang-Li Liu

Kai-Jie Taso

A metallic panel assembly having multilayer arrays of micropores includes a backlight module and a panel body. The backlight module is constituted of a first and a second light-guiding plate. First and second light-guiding microstructures are provided on the first and second light-guiding plates. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. The panel body is disposed on one side surface of the first light-guiding plate. The panel body has thereon a plurality of hollowed portions with the hollowed portions encircling a key body. The key body has thereon a plurality of micropores. The plurality of micropores is arranged to form a pattern of each key body. When the first or second set of light-emitting units are lighted up, the light enters one side of the first or second light-guiding plate. The light is reflected by the first or second light-guiding microstructures on the corresponding key panel, so that the user can see the position of each key clearly.

Metallic panel assembly having multilayer arrays of micropores

A keypad module includes a non-backlight layer made of an opaque thin sheet, and a key layer made of an ultraviolet curable resin. One surface of the non-backlight layer is provided thereon with a recognition region. The key layer has a base portion and a plurality of pressing portions protruding from the base portion. The base portion is overlapped with and bonded to the surface of the non-backlight layer on which the recognition region is provided. Each of the pressing portions is arranged to correspond to the recognition region. The panel further includes a telecommunication module located below the keypad module.

Keypad module of non-backlight panel and panel assembly of the same

A method for manufacturing a metallic keypad panel having a ripple luster. First, a metallic thin plate is prepared. The metallic thin plate is subjected to an etching process, thereby forming a plurality of hollowed portions on the metallic thin plate. The hollowed portions are used to define a pressing region for the keypad and icons for the surface of the pressing region. The metallic thin plate is cut to form a metallic keypad panel having a predetermined shape. An electroplated layer is coated on the surface of the metallic keypad panel. Then, a layer of protective film is adhered on one side surface of the metallic keypad panel. The metallic keypad panel is disposed into a transparent mold. After an ultraviolet curable resin is injected into the mold, a light source illuminates the transparent mold to cure the ultraviolet curable resin in the mold to form a pattern layer. Finally, after the protective film on the other surface of the metallic keypad panel is peeled off, an adhesive layer is applied on the other surface of the metallic keypad panel. An elastic layer having a plurality of protrusions is adhered on the surface of the adhesive layer. Via the above steps, the metallic keypad panel is manufactured completely.

Method for manufacturing metallic panel having ripple luster

In a method of manufacturing a metal keypad panel with a micropore array, a metal laminate is prepared and etched to form micropores on the metal laminate, and a filling is coated on a surface of the metal laminate and permeated into the micropores. After the metal laminate is punched to form a metal keypad panel in a predetermined shape, the metal keypad panel is put into a mold. After a plastic material is injected into the mold, a pattern layer is formed on a side of the metal keypad panel, and then a backlight module is attached onto another side of the metal keypad panel. The backlight module has patterns, and the shape of the patterns is formed by arranging light guide microstructures. Finally, an electric signal module is attached onto a side of the backlight module to complete manufacturing the metal keypad panel.

Method of manufacturing metal keypad panel with micropore array

A metal keypad panel structure with a micropore array includes a metal keypad panel, a filling, a pattern layer, a backlight module and an electric signal module. The metal keypad panel has micropores filled with the filling. The pattern layer is on a side of the metal keypad panel. The backlight module is a guide light plate attached onto another side of the metal keypad panel and has patterns, each composed of light guide microstructures. When a light is entered into the guide light plate, the light guide microstructures focus and project the light onto the metal keypad panel to allow users to see the position of each press key clearly.

Metal keypad panel structure with micropore array

A metallic thin plate is etched to form a plurality of keypads having hollowed portions and cut to form a metallic keypad panel having a predetermined shape. Then, an electroplated layer is coated on the surface of the metallic keypad panel. A layer of protective film is adhered on the non-electroplated surface of the metallic keypad panel, which is disposed in a mold. A plastic material is then injected into the mold, so that the plastic material is formed into a pattern layer. In addition, a plastic thin plate is prepared with one side surface printed with a displaying layer, is adhered on elastic bodies having a plurality of protrusions and is cut to form an elastic layer. Finally, after the protective film is peeled off, an adhesive layer is applied thereon. The elastic layer is adhered on the surface of the adhesive layer.

Method for manufacturing metallic keypad panel having ripple luster

A method for manufacturing a panel having a surface of three-dimensional patterns and the structure thereof, first of all, provides a piece body, on the surface of which plane panel patterns are arranged by means of ink printing process, and which is thermally pressed into a plurality of projected three-dimensional panels. The piece body having projected three-dimensional panels is then placed between a lower mould and a first upper mould. A material of hard resin is injected into the clearance between the lower mould and the three-dimensional panel surfaces, and thus a transparent cladding layer capable of wear-resistance and protection for three-dimensional panels is formed. Next, material of hard resin is again injected into the space between the inner wall surfaces of the three-dimensional panels and a second upper mould for forming a supporting layer for supporting the three-dimensional panels. Afterwards, a material of rubber is injected into the space between a third upper mould and the inner wall surfaces of three-dimensional panels to form an elastic layer. At last, castings on the piece body and three molded layers are integrally cut according to respective contour to thus complete the manufacturing process of a single panel structure.

Method for manufacturing electronic device panel and structure thereof

A metallic panel assembly having a ripple luster includes an elastic layer, an adhesive layer, a metallic keypad panel, an electroplated layer and an ultraviolet curable resin layer. The elastic layer has a carrier. The carrier is provided thereon with a plurality of protrusions. The adhesive layer is provided on one side surface of the carrier. The metallic keypad panel is provided on one side surface of the adhesive layer and has a thin plate thereon. The plate is provided thereon with a first hollowed portion and a second hollowed portion. The first hollowed portion is set as a pressing region of a key, and the second hollowed portion is set as an icon on the surface of the pressing region. The electroplated layer is provided on one side surface of the metallic keypad panel and penetrates into the first hollowed portion and the second hollowed portion. The ultraviolet curable resin layer is provided on one side surface of the electroplated layer to seal and fill the first hollowed portion and the second hollowed portion. The ultraviolet curable resin layer has a carrier thereon, and one side surface of the carrier is provided with a pattern surface. When external light illuminates the pattern surface of the metallic keypad panel, the pattern surface generates a reflective effect of a ripple luster.

Metallic panel assembly having ripple luster

A metallic keypad panel assembly having a ripple luster includes a thin plate, a displaying layer, an elastic layer, an adhesive layer, a metallic keypad panel, an electroplated layer and a pattern layer. One side surface of the thin plate is printed with a film to form a displaying layer. The elastic layer is adhered on one side surface of the displaying layer and has a carrier thereon. One side surface of the carrier is provided thereon with a plurality of protrusions. The metallic keypad panel is disposed on one side surface of the thin plate and has a plate body thereon. The plate body is provided thereon with a first hollowed portion and a second hollowed portion. The first hollowed portion defines a pressing region of a keypad, and the second hollowed portion is set as an icon on the surface of the pressing region. The electroplated layer is provided on one side surface of the metallic keypad panel and penetrates into the first hollowed portion and the second hollowed portion. The pattern layer is provided on one side surface of the electroplated layer to seal and fill the first hollowed portion and the second hollowed portion. When external light illuminates the pattern layer of the metallic keypad panel, the pattern layer generates a reflective effect of a ripple luster.

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Taoyuan, Taiwan

Che-Tung Wu