Advanced Semiconductor Engineering, Inc.

Che-Ting Liu

Yu-Ting Lu

Ming-Chi Liu

Chih-Hsiang Hsu

Kai-Chiang Hsu

Jheng-Yu Hong

Po-Chun Lee

Yu-Pin Tsai

Yu-Ping Tsai

A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

Method and system for manufacturing a semiconductor package structure

A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

Semiconductor package structure and method of manufacturing the same

Growing community of inventors

Kaohsiung, Taiwan

Che-Ting Liu