Htc Corporation

Che-Jung Chang

Chia-Chu Ho

Wei-Hong Gao

Huan Yi Chu

A circuit board and a layout method thereof are provided. The circuit board includes a first metal layer, a second metal layer, and a third metal layer. The first metal layer forms multiple first reference conductive wires. The second metal layer forms at least one signal transmission wire. The third metal layer forms multiple third reference conductive wires. The first metal layer, the second metal layer, and a third metal layer are overlapped with each other, and each of the first reference conductive wires is not completely overlapped with each of the second reference conductive wires.

Circuit board and layout method thereof

A circuit board includes a first layer, a second layer, a third layer, a plurality of plating through holes, at least one first intermediate layer and at least one second intermediate layer. The first layer and the second layer are used as reference voltage planes. A plurality of transmission wires are disposed on the third layer. The transmission wires are coupled to a wireless signal transceiver and a plurality of antenna arrays; wherein the third layer is disposed between the first layer and the second layer. The plating through holes are disposed at sides of the third layer, wherein the plurality of plating through holes are configured to connect the first reference voltage plane with the second reference voltage plane. The first intermediate layer is disposed between the first layer and the third layer, and the second intermediate layer is disposed between the second layer and the third layer.

Circuit board

A common mode filter is disposed on a circuit board. A signal layer of the circuit board has a differential signal wire pair. The common mode filter has a slot structure and a filtering frequency adjusting device. The slot structure is formed on a reference voltage layer of the circuit board, wherein the slot structure surrounds the differential signal wire pair. The filtering frequency adjusting device is disposed on a corner part of the slot structure, wherein the filtering frequency adjusting device includes at least one of at least one capacitor and at least one inductor, and is disposed on the circuit board across the differential signal wire pair.

Common mode filter

A circuit board structure and a layout structure thereof are proposed. The layout structure includes at least one signal transmission line, at least one bonding pad, and at least one impedance adjusting wire. The signal transmission line, the bonding pad, and the impedance adjusting wire are disposed on a first circuit board. The impedance adjusting wire is electrically connected between the signal transmission line and the bonding pad. The impedance adjusting wire is disposed along a periphery of the bonding pad, and at least partially surrounds the bonding pad.

Circuit board structure and layout structure thereof

A circuit including a grounding layer, a pair of signal lines and an insulating layer is provided. The grounding layer has a void region. The void region includes a first straight line part, a second straight line part and a third straight line part. The second straight line part and the third straight line part are connected to two ends of the first straight line part. An orthogonal projection of the pair of signal lines on the grounding layer crosses the first straight line part. The insulating layer is disposed between the grounding layer and the pair of signal lines and separates the grounding layer from the pair of signal lines.

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Taoyuan, Taiwan

Che-Jung Chang