Dialog Semiconductor (uk) Limited

Che-Han Jerry Li

Jesus Mennen Belonio

Shih-Wen Tang

Jesus Mennen Belonio, Jr

Ernesto Gutierrez, Iii

Shou Cheng Eric Hu

An inductor package is described comprising a mold interconnection substrate having an embedded spiral coil inductor, a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil in between the copper posts, and a semiconductor die mounted on the mold interconnection substrate and connected to the fan-out redistribution layer.

3D MIS-FO hybrid for embedded inductor package structure

A single-side stack up system in package is described. The system in package comprises a first interconnection having redistribution layers therein and having a top surface and a bottom surface, at least one first silicon die mounted on the top surface of the first interconnection and embedded in a first molding compound, at least one first passive component mounted on the top surface of the first interconnection side-by-side with the at least one first silicon die and embedded in a second molding compound, and solder balls mounted on the bottom surface of the first interconnection wherein the solder balls provide package output.

Single side modular 3D stack up SiP with mold cavity

A system in package is described comprising a substrate having a top side and a bottom side, having redistribution layers therein, and having a cavity extending partially into the top side of the substrate. At least one passive component is mounted on the top side of the substrate and into the cavity and embedded in a first molding compound. At least one silicon die is mounted on the bottom side of the substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. Solder balls are mounted through openings in the second molding compound to the redistribution layers wherein the solder balls provide package output.

Growing community of inventors

Taichung, Taiwan

Che-Han Jerry Li