Speedlink Technology Inc.

Swiftlink Technologies Inc.

Huizhou Speed Wireless Technology Co., Ltd.

Che-Chun Kuo

Thomas C Chen

Taiyun Chi

Bin Yu

Zhanyi Qian

Robert Hill

An RF frontend IC device includes an RF transceiver to transmit and receive RF signals and a frequency synthesizer to perform frequency synthetization to operate within a predetermined frequency band. The frequency synthesizer generates an LO signal to the RF transceiver to enable the RF transceiver to transmit and receive RF signals within the predetermined frequency band. The frequency synthesizer includes a QPG circuit to generate signals shifted in phases based on the LO signal and a phase shifting circuit to generate quadrant signals based on the signals shifted in phases. Each of the quadrant signals corresponds to one of the four quadrants in phases in the respective quadrant spaces. The phase shifting circuit includes multiple phase switches operable in a collaboration manner to further shift in phase based on the signal shifted in phases to generate the quadrant signals in proper quadrant spaces.

Wide-band 360 degree phase shifter utilizing right-hand and left-hand transmission line switches for RF communications

An RF antenna includes a first substrate having a first top surface and a first bottom surface and a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon. The RF antenna further includes a low-band (LB) radiation element disposed on the first top surface of the first substrate. The LB radiation element is to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band. The RF antenna further includes multiple high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate. Each HB radiation element is to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.

Antenna element structure suitable for 5G CPE devices

A flip chip IC device utilized in RF transceivers includes a bare die having a number of metalized pads and each metalized pad has a solder ball deposited thereon. The flip chip IC device further includes a substrate having a number of connector pads corresponding to the metalized pads. The connector pads are connected to one or more electronic components disposed on the substrate via a number of connector strips. The bare die is flipped up-side-down such that the metalized solder pads are aligned and connected with the connector pads of the substrate via the solder balls. At least one of the connector strips includes a strip section having an uneven strip width configured to compensate an impedance of a transmission line formed based on a connection between a metalized pad of the bare die and a connector pad of the substrate to match predetermined impedance.

Impedance compensation of flip chip connection for RF communications

According to one embodiment, a differential power amplifier includes a pair of transistors, a transformer coupled to the drain terminals of the transistors, and an output transmission line. The differential power amplifier operates in a range of frequencies from a lower operating frequency to an upper operating frequency to provide a relatively linear gain between the lower operating frequency and the higher operating frequency. The drains of the transistors are coupled to the primary winding of the transformer. The output transmission line is coupled to the secondary winding of the transformer. The output transmission line further includes at least one inductor-capacitor (LC) circuit that is configured to match predetermined output impedance in view of the lower and upper operating frequencies of the differential power amplifier.

Wideband distributed differential power amplifier utilizing metamaterial transmission line conception with impedance transformation

A power amplifier includes a transistor operating in a range of frequencies from a lower operating frequency to a higher operating frequency to provide a relatively linear gain between the lower operating frequency and the higher operating frequency, an input transmission line circuit coupled to a gate terminal of the transistor, and an output transmission line circuit coupled to a drain terminal of the transistor. The input transmission line includes an inductor-capacitor (LC) circuit that resonates at a first resonant frequency equaled to or higher than the higher operating frequency. The output transmission line includes an inductor-capacitor-inductor (LCL) circuit and a capacitor-inductor-capacitor (CLC) circuit. The LCL circuit resonates at a second resonant frequency equaled to or lower than the lower operating frequency. The CLC circuit resonates at a third resonant frequency equaled to or higher than the higher operating frequency.

Wideband distributed power amplifier utilizing metamaterial transmission line conception with impedance transformation

An RF frontend circuit includes an RF transceiver and a frequency synthesizer to perform frequency synthetization in a wide frequency spectrum. The frequency synthesizer generates an LO signal to the RF transceiver. The frequency synthesizer includes a quadrature signal generator to generate a quadrature LO signal based on the LO signal. The quadrature signal generator includes a first transformer. A first primary winding of the first transformer is disposed on a first substrate layer of the IC and a secondary winding of the first transformer is disposed on a second substrate layer of an IC. A second transformer is coupled to the first transformer in series. A second primary winding of the second transformer is disposed on the first substrate layer of the IC and a secondary winding of the second transformer is disposed on the second substrate layer of the IC.

Growing community of inventors

Atlanta, GA, United States of America

Che-Chun Kuo