Nxp B.v.

Nxp Usa, Inc.

Nexperia B.v.

Chayathorn Saklang

Chanon Suwankasab

Amornthep Saiyajitara

Stephen Ryan Hooper

Russell Joseph Lynch

Wiwat Tanwongwan

Bernd Offermann

Crispulo Estira Lictao, Jr

Scott M Hayes

Verapath Vareesantichai

Namrata Kanth

Dominic (PohMeng) Koey

James Lee Grothe

Surachai Tangsiriratchatakun

A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.

Semiconductor device with attached battery and method therefor

A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.

Semiconductor device with embedded battery and method therefor

A semiconductor package comprises a leadframe, a component module, and a semiconductor die. The leadframe has a plurality of insertion terminals, a split die pad, and one or more leads. The component module has one or more passive components mounted on a substrate. The semiconductor die has an integrated circuit. The component module is mounted on a split die pad at a first surface of the leadframe and forms an electrical connection with the insertion terminals. Further, the semiconductor die is mounted on the split die pad at a second surface of the leadframe which is opposite to the first surface.

Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof

An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

Shielded electronic package and method of fabrication

A device includes a leadframe and an electronic component. The leadframe includes a first leadframe element having a first surface and a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface. A first flange extends from a first outer edge of the first leadframe element and extends away from the first surface of the first leadframe element. A second flange extends from a second outer edge of the second leadframe element and extends away from the second surface of the second leadframe element. The electronic component is coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.

Electronic device, device package, and method of fabrication

A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.

Semiconductor device with integral EMI shield

A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

Press-fit semiconductor device

A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

Sensor module with blade insert

Various aspects are directed to apparatuses, systems and related methods involving the mitigation of issues relating to thermal expansion and contraction of lead fingers of an integrated circuit package. Consistent with one or more embodiments, lead fingers on a leadframe substrate each have a locking structure that secures the lead finger in place relative to the substrate. The lead fingers provide a location to attach a bond wire to an integrated circuit, and connect the bond wire to terminals at a perimeter of the leadframe. The locking structure and arrangement of the lead fingers mitigate issues such as cracking or breaking of a solder connection of the bond wire to the leadframe, which can occur due to thermal expansion and contraction.

Lead finger locking structure

A packaged electronic device has first and second lead frame leads and a passive electronic component mounted, across a gap between the leads, on the top sides of the leads, using an adhesive. Facing lateral sides of the leads each include a recess that receives the adhesive. The recess promotes adhesion between the electronic component and the corresponding lead while limiting spread of the adhesive on the bottom side of the electronic component. The adhesive in the recesses promotes adhesion of the component to the leads by inhibiting cracking, and enhances inspection capability at the device backside.

Growing community of inventors

Bangplee, Thailand

Chayathorn Saklang