Analog Devices,inc.

Charly El-Khoury

Srivatsan Parthasarathy

Nathan R Carter

John Pierdomenico

Zoltan Frasch

Francisco Santos

In one embodiment, an apparatus includes a package that encompasses at least a first integrated circuit die and a second integrated circuit die. The first integrated circuit die is attached to the package and includes one or more electrical overstress/electrostatic discharge (EOS/ESD) protection circuits. The second integrated circuit die is attached to the package and electrically coupled to the first integrated circuit die such that at least one component of the second integrated circuit die is protected from EOS/ESD by the first integrated circuit die.

Overvoltage protection for multi-chip module and system-in-package

An amplifier system with digital adaptive power boost includes a charge pump for providing a power supply to an amplifier. The charge pump may switch between a fixed input DC voltage and a boosted value for a certain period of time in response to an increase in an input signal to the amplifier. The charge pump may use a switching transistor which is switched on only when the input signal to the amplifier exceeds a threshold. The amplifier system may be used for envelope tracking, especially for envelope tracking of low duty cycle signals, e.g., xDSL or vDSL.

Growing community of inventors

Andover, MA, United States of America

Charly El-Khoury