Basf Se Corporation

Charlotte Emnet

Dieter Mayer

Marco Arnold

Cornelia Roeger-Goepfert

Roman Benedikt Raether

Alexander Fluegel

Alexandra Haag

Marcel Patrik Kienle

Nadine Engelhardt

Lucas Benjamin Henderson

Sophia Ebert

Michael Siemer

Nicole Meier

Harald Hoerhammer

Sathana Kitayaporn

Cornelia Röger-Göpfert

Verena Strempel

Harald HÖRHAMMER

Alexander FLÜGEL

Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1[A-B-A'-Z][Y—Z]  (L1)whereB is a diacid fragment of formula L2 A, A' are amine fragments independently selected from the group consisting of formula L3a Y is a co-monomer fragment;Z is a coupling fragment of formula L4 n is an integer of from 1 to 400; andm is 0 or an integer of from 1 to 400.

Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent

Described herein is a composition including metal ions consisting essentially of cobalt ions, and a specific monomeric and polymeric suppressing agent including a carboxylic, sulfonic, sulfinic, phosphonic, or phosphinic acid functional groups which show a suppressing effect that is required for void-free bottom-up filling of nanometer-sized recessed features.

Composition for cobalt plating comprising additive for void-free submicron feature filling

The invention relates to a polyamine-based or polyhydric alcohol-based suppressing agent. The suppressing agent is modified by reaction with a compound that introduces a branching group into the suppressing agent before they are reacted with an alkylene oxide. The suppressing agent shows extraordinary superfilling properties, particularly when used to fill in features having extremely small aperture sizes and/or high aspect ratios.

Composition for metal plating comprising suppressing agent for void free filing

A method of detecting space debris includes: generating a virtual space debris in accordance with the law of conservation of mass by applying a debris breakup model to an object of breakup origin; calculating an orbit of each virtual space debris based on a debris orbit propagation model; and generating appearance frequency distribution of a motion vector of each virtual space debris on the celestial sphere based on the orbit calculation. The above operations are executed multiple times. The method further includes setting a search range vector based on a motion vector having a high level of the appearance frequency distribution of the motion vector, and applying a stacking method to regions in images captured at time intervals during the fixed point observation, the regions being shifted along the search range vector sequentially in the order of capture, thereby detecting space debris appearing on the images.

Composition for metal electroplating comprising leveling agent

A composition for metal plating comprising a source of metal ions and at least one leveling agent comprising at least one polyaminoamide comprising a polymer fragment of formula (I) or derivatives thereof obtainable by complete or partial protonation or N-quarternisation. 

A cobalt electrodeposition composition comprising cobalt ions, and particular leveling agents comprising X&#x2014;CO&#x2014;O&#x2014;R, X&#x2014;SO&#x2014;O&#x2014;R, X&#x2014;PO(OR), X&#x2014;SO&#x2014;O&#x2014;Rfunctional groups, wherein Xis a divalent group selected from (i) a chemical bond (ii) aryl, (iii) Cto Calkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group &#x2014;X&#x2014;X&#x2014;, (v) an alkylaryl group &#x2014;X&#x2014;X&#x2014;, and (vi) &#x2014;(O&#x2014;CHR)O&#x2014;, Ris selected from H and Cto Calkyl. Ris selected from H and Cto Calkyl, Xis a divalent aryl group, Xis a divalent Cto Calkandiyl group.

Composition for cobalt electroplating comprising leveling agent

According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol of formula (I)X(OH)&#x2003;&#x2003;(I)by condensation with b) at least one alkylene oxide to form a polyhydric alcohol condensate comprising polyoxyalkylene side chains, wherein n is an integer from 3 to 6 and X is an n-valent linear or branched aliphatic or cycloaliphatic radical having from 2 to 10 carbon atoms, which may be substituted or unsubstituted.

Composition for metal plating comprising suppressing agent for void free submicron feature filling

A composition comprising a source of metal ions and at least one additive comprising a polyalkyleneimine backbone, said polyalkyleneimine backbone having a molecular weight Mw of from 300 g/mol to 1000000 g/mol, wherein the N hydrogen atoms in the backbone are substituted by a polyoxyalkylene radical and wherein the average number of oxyalkylene units in said polyoxyalkylene radical is from 1.5 to 10 per N&#x2014;H unit.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,wherein

A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R, R, Rare each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the a or &#x3b2; position relative to the nitrogen atom of the imidazole rings is an integer. 

A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.

Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features

A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation. 

A composition comprising a source of metal ions and at least one leveling agent obtainable by condensing at least one trialkanolamine of the general formula N(R&#x2014;OH)(Ia) and/or at least one dialkanolamine of the general formula R&#x2014;N(R&#x2014;OH)(Ib) to give a polyalkanolamine(II), wherein the Rradicals are each independently selected from a divalent, linear or branched aliphatic hydrocarbon radical having from 2 to 6 carbon atoms, and the Rradicals are each selected from hydrogen and linear or branched aliphatic, cycloaliphatic and aromatic hydrocarbon radicals having from 1 to 30 carbon atoms, or derivatives obtainable by alkoxylation, substitution or alkoxylation and substitution of said polyalkanolamine(II).

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Stuttgart, Germany

Charlotte Emnet