Apple Inc.

Silicon Bandwidth, Inc.

Quantum Leap Packaging, Inc.

Charley T Ogata

Martin Paul Grunthaner

John Stephen Smith

Sinan Filiz

Christopher J Butler

Shin John Choi

Brian Quentin Huppi

James E Pedder

Dhaval Chandrakant Patel

Stanford W Crane, Jr

Myoung-soo Jeon

Steven Porter Hotelling

Michael Benjamin Wittenberg

Peter W Richards

Steven James Martisauskas

Romain A Teil

Christian M Sauer

Anthony D Minervini

Zijing Zeng

Josh Nickel

James C Clements

Rui Qiao

Jose Emmanuel Schutt-Aine

Zsolt Horvath

Helia Rahmani

Ton-Yong Wang

Jiandong Yu

Vincent Alcaria

Patrick Codd

Andreas C Cangellaris

Wanfeng Huang

Embodiments described herein are directed to a temperature measurement device that includes a sensor body configured to be placed on a skin of a user. The temperature measurement device can include a first section defining a first lower surface and having a first thickness, a second section defining a second lower surface and having a second thickness, and a channel separating the first lower surface from the second lower surface. The temperature measurement device can also include a first set of temperature sensors positioned across the first thickness, a second set of temperature sensors positioned across the second thickness, and a processor configured to estimate a tissue temperature of the user based on comparing temperature signals from the first set of temperature sensors with temperature signals from the second set of temperature sensors.

Miniature external temperature sensing device for estimating subsurface tissue temperatures

A force-sensitive device for electronic device. The force inputs may be detected by measuring changes in capacitance, as measured by surface flex of a device having a flexible touchable surface, causing flex at a compressible gap within the device. A capacitive sensor responsive to changes in distance across the compressible gap. The sensor can be positioned above or below, or within, a display element, and above or below, or within, a backlight unit. The device can respond to bending, twisting, or other deformation, to adjust those zero force measurements. The device can use measure of surface flux that appear at positions on the surface not directly the subject of applied force, such as when the user presses on a part of the frame or a surface without capacitive sensors.

Force sensor incorporated into display

A device configured to sense a touch on a surface of the device. The device includes a cover and a force-sensing structure disposed below the cover. The force-sensing structure may be positioned below a display and used in combination with other force-sensing elements to estimate the force of a touch on the cover of a device.

Force determination employing sheet sensor

An optical force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Temperature compensating sensor having a compliant layer separating independent force sensing substrates and sense circuitry to obtain a relative measure between the force sensing substrates

An optical force sensor, which may be used as input to an electronic device. The optical force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Temperature compensating force sensor

Force determination employing sheet sensor and capacitive array

A force sensing device for electronic device. The force inputs may be detected by measuring changes in capacitance, as measured by surface flex of a device having a flexible touchable surface, causing flex at a compressible gap within the device. A capacitive sensor responsive to changes in distance across the compressible gap. The sensor can be positioned above or below, or within, a display element, and above or below, or within, a backlight unit. The device can respond to bending, twisting, or other deformation, to adjust those zero force measurements. The device can use measure of surface flux that appear at positions on the surface not directly the subject of applied force, such as when the user presses on a part of the frame or a surface without capacitive sensors.

Force sensing based on capacitance changes

A sensor layer, such as a force sensor layer, can be in included in an electronic device. The sensor layer includes a patterned compliant layer that is positioned between a first substrate and a second substrate. The patterned compliant layer includes multiple angled compliant elements that are angled at one or more angles with respect to the first and second substrates.

Sensor layer having a patterned compliant layer

An optically transparent force sensor that may compensate for environmental effects, including, for example, variations in temperature of the device or the surroundings. In some examples, two force-sensitive layers are separated by a compliant layer. The relative electrical response of the two force-sensitive layers may be used to compute an estimate of the force of a touch that reduces the effect of variations in temperature. In some examples, piezoelectric films having anisotropic strain properties are used to reduce the effects of temperature.

Temperature compensating transparent force sensor having a compliant layer

An optically transparent force sensor, which may be used as input to an electronic device. The optically transparent force sensor may be configured to compensate for variations in temperature using two or more force-sensitive components that are formed from materials having different temperature- and strain-dependent responses.

Temperature compensating transparent force sensor

A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.

Die package for connection to a substrate

A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

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Cupertino, CA, United States of America

Charley T Ogata