National Starch and Chemical Investment Holding Corporation

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Henkel US IP Lcc

Alliedsignal Inc.

Henkel Corporation

Parke-davis Company

Charles Willard Paul

Matthew L Sharak

Yuxia Liu

Peter D Palasz

Mitchell J Blumenthal

Andrea Keys Eodice

Wu Suen

Gary F Raykovitz

Paul A Altieri

Paul B Foreman

Qiwei He

Yuhong Hu

Dirk Kasper

Donald E Herr

Maria Xenidou

Darshak R Desai

Maria Cristina Barbosa DeJesus

Robert L Billmers

Mark M Konarski

Quinn K Tong

Thomas F Kauffman

Michael G Harwell

Yongxia Wang

Daniel B Solarek

Dilip K Ray-Chaudhuri

Michael Timothy Philbin

Jules E Schoenberg

Rose Ann Schultz

Scott Charles Schmidt

Marisa Phelan

Bing T Wu

Smita M Shah

Marcus Heemann

Matthew J Henley

Jiangbo Ouyang

Joseph E Mackey

Laxmisha Sridhar

Kundan M Patel

Steven P Fenelli

Allison Yue Xiao

Wayne K Chu

Dale L Haner

Andrew Slark

Ziyi Hu

Cynthia L Meisner

Richard J Ellis

Petra Padurschel

Salvador Alvarado

Robert W R Humphreys

Cynthia Cain

Peter A Walter

Leisa A Ryan

Mahesh Sambasivam

Lydia Wagner

Stephen F Hatfield

Ian W Cottrell

Sebastian Kostyra

Yayun Liu

David C Rawlins

Melissa J Vitale

Maria Tolchinsky

Lie-Zhong Gong

Dennis Neigel

Brian D Morrison

Eric W George

David J Good

Qiwen Han

Geetanjaliben Shah

Peter D Pierce

Maja Schroeder

Martin Riswick

Valerie Alexis

Eddie Park

Line Willis

Gregory A Sweeey

Abhi Narthana

Robert J Billmers

Karen Dare

Stephen C Arnold

Qiwel He

Ryan A Leisa

Noah Macy

Peter Anthony Callais

Jeffrey T Carter

Mitchell Blumenthal

Darshak Desai

Cynthia L Cain

Maria Cristina Barbosa De Jesus

Smita Shah

Laxmisha M Sridhar

The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.

Hot melt adhesives and uses thereof

The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.

Adhesive compositions and use thereof

Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Optically clear hot melt adhesives and uses thereof

The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Curable encapsulants and use thereof

It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105&#xb0; C. and viscosity of less than about 1,900 cP at 190&#xb0; C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.

Low application temperature amorphous poly-a-olefin adhesive

An ultraviolet (UV) crosslinkable acrylic pressure sensitive adhesive comprises an acrylic copolymer and a cationic photoinitiator. The acrylic copolymer comprises pendant reactive functional groups. The pressure sensitive adhesive formed from the acrylic copolymer with the pendant reactive functional groups result in high green strength and/or high temperature holding strength of the adhesive.

Cationic UV-crosslinkable acrylic polymers for pressure sensitive adhesives

The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70&#xb0; C. to 240&#xb0; C.

Molding and overmolding compositions for electronic devices

Adhesive composition and use thereof

Provided are two part hybrid adhesives that comprise an organoborane amine complex, a polyamine, a component polymerizable by free radical polymerization, and a polyisocyanate component. An isocyanate terminated prepolymer can advantageously be used in the practice of the invention. The adhesive is particularly well suited for low surface energy plastic bonding.

Two part hybrid adhesive

High green strength reactive hot melt adhesives are prepared using silane-functional liquid polymers. The adhesive are formulated using a silane-reactive polymer or, alternatively, a non-silane-reactive polymer together with a compatible tackifier.

Reactive hot melt adhesive

Low application temperature amorphous poly-&#x3b1;-olefin adhesive

The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanate content.

Moisture cure hot melt adhesives

Growing community of inventors

Madison, NJ, United States of America

Charles Willard Paul