Adeia Semiconductor Bonding Technologies Inc.

Fotonation Limited

Charles White

Ilyas Mohammed

Stuart E Wilson

Hari Chakravarthula

Belgacem Haba

Michael James Nystrom

A device is provided with a housing adapted to engage a portion of a head of a user, such as the ear of the user. The device includes a camera component adapted to face in the same direction as the user when engaged with the portion of the head of the user. The device may be adapted to be controlled using voice commands from the user.

Wearable ultra-thin miniaturized mobile communications

A cellular telephone is provided with a wearable housing, desirably in a form which can be concealed in the user's clothing, wallet, or other place. The housing may be devoid of switches or buttons for controlling the cellular telephone, and control inputs can be provided through free space communications such as a short-range radio link. A module for use in portable communications devices includes chips superposed on one another on a stack, and incorporates an interposer for facilitating connections between the chips.

The present invention provides an integrated circuit chip assembly and a method of manufacturing the same. The assembly includes a package element having a top surface and an integrated circuit chip having a top surface, a bottom surface, edge surface between the top and bottom surfaces, and contacts exposed at the top surface. The package element is disposed below the chip with the top surface of the package element facing toward the bottom surface of the chip. At least one spacer element resides between the top surface of the package element and the bottom surface of the chip. According to one embodiment, the at least one spacer element may form a substantially closed cavity between the package element and the integrated circuit chip. According to another embodiment, first conductive features may extend from the contacts of the chip along the top surface, and at least some of said first conductive features extend along at least one of the edge surfaces of the chip.

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Los Altos, CA, United States of America

Charles White