International Business Machines Corporation

Globalfoundries Inc.

Globalfoudries Inc.

Charles W Griffin

David Brian Stone

Robert F White

James V Crain, Jr

Jason E Blanchet

Fen Chen

Roger Aime Dufresne

Cathryn Jeanne Christiansen

Kevin W Kolvenbach

Marla A Haddon

Biao Luo

John R Malpass

Benjamin J Montello

Various particular embodiments include a via testing structure, including: a first terminal coupled to a first set of sensing lines in a top level of the structure; a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement; a third terminal coupled to a third set of sensing lines in a bottom level of the structure; and a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.

Via leakage and breakdown testing

Wiring structures with dummy metal features and methods of manufacture are disclosed. A structure includes a metal wiring structure, and dummy metal features in electrical and direct physical contact with the metal wiring structure in a same plane as the metal wiring structure. The dummy metal features do not change a resistance of the metal wiring structure and are remote from other structures.

Wiring structures

Method for prescriptive learning. The method includes providing a user independent hierarchy of competencies, competency characteristics and assessments with associated rules that identify learning activities and identifying a user specific path through the hierarchy for a selected competency and competency characteristic based on the hierarchy, scoring of at least one question associated with at least one assessment associated with the selected competency characteristic. The rules and user specific information provide a user specific identification of learning activities.

Method and system for creating and delivering prescriptive learning

A test chip module for testing the integrity of the flp chip solder ball interconnections between chip and substrate. The interconnections, are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Packaging reliability superchips

A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Packaging reliability super chips

Growing community of inventors

Jericho, VT, United States of America

Charles W Griffin