Eco-snow Systems, Inc.

Rave N.p., Inc.

Hughes Aircraft Company

Raven N.p., Inc.

Charles W Bowers

Mehdi Balooch

Wilfried Krone-Schmidt

Ivin Varghese

Michael R Borden

Thomas J Kosic

Steven R Askin

Werner V Brandt

A valve assembly including an actuated valve and a sensor module is disclosed. The actuated valve includes a body defining a chamber, a first fluid port coupled to the chamber, and a second fluid port coupled to the chamber. The actuated valve further includes a movable stem disposed at least partially within the chamber, the movable stem having a closed position and an open position relative to the chamber, and an actuator coupled to the stem. The sensor module is attached to the actuated valve, and the sensor module includes a microcontroller, and at least one sensor coupled to the microcontroller, the at least one sensor providing a signal associated with a status of the actuated valve.

Smart valve

A nozzle for providing carbon dioxide for cleaning is disclosed. The nozzle includes a reservoir for receiving liquid carbon dioxide, a barrel defining a passageway therethrough, the passageway extending to an outlet of the barrel, an orifice effecting fluid communication between the reservoir and the passageway, and a screen member constructed and arranged for interrupting flow of the carbon dioxide pellets greater than a select size from being emitted from the passageway of the barrel. Liquid carbon dioxide flows through the orifice to phase transfer into gaseous carbon dioxide and carbon dioxide pellets in the passageway. An internal diameter of the passageway is smaller than an internal diameter of the reservoir.

[object Object]

A fluid mixing apparatus and method include a first fluid assembly having at least one fluid nozzle for providing a first fluid; a second fluid assembly having at least one fluid mixing nozzle sized and shaped to be received by the at least one fluid nozzle for providing a second fluid into the first fluid; a mixing region disposed where the at least one fluid nozzle and the at least one fluid mixing nozzle coact in spaced relationship for providing turbulence to the first and second fluids, thereby providing a fluid mixture thereof; and a passageway in communication with the mixing region for expanding the fluid mixture into a different phase.

Fluid injection assembly for nozzles

A nozzle and method of providing COfor cleaning includes providing a COflow; phase transferring the COflow into gaseous COand COpellets; interrupting the COflow with a screen member; retaining the COpellets of a select larger size upstream of the screen member; permitting the COpellets of a select smaller size to pass through the screen member for cleaning.

A method for the selective removal of the metal film layer accumulated upon a photoresist layer during processing of substrates using a stream of carbon dioxide spray without disturbing conductor portions is provided. A constant stream of high pressure CO snow is applied to the metal film layer thereby rapidly cooling the metal layer on top of said resist layer causing it to shrink rapidly, and to debond, and peel from the photoresist layer underneath. The temperature of the substrate is raised and maintained at significantly higher than room temperature. Continuing the application of the CO spray causes thermal shock to the photoresist under the metalized layer causing large cracks in the remaining metal layer portions, said cracks typically including at least one loose metal edge. The CO spray is continually applied to the cracks thereby peeling away the remaining metal portions, leaving the exposed photoresist and underlying surface features. Preferably, continued treatment of the surface with CO snow particles erodes a surface layer of the photoresist and heavily cross-linked layers created during the metalization process. After the metal layer and the surface layer of the photoresist are removed, a simple chemical strip, such as acetone, completely removes all the remaining resist, leaving the wafer with undamaged conductor portions.

Method for selective metal film layer removal using carbon dioxide jet spray

Liquid CO is expanded in specially designed primary and secondary nozzles to produce frozen solid CO . The impurities initially contained in the liquid CO are trapped inside of the frozen CO , which is collected in a clean container. The container is emptied on top of a high purity surface. The impurities are concentrated on the surface, since these impurities are non-volatile and do not escape with the CO gas formed as the frozen CO is heated by the ambient temperature to its sublimation point. After all of the frozen CO has sublimed, the surface can be analysed by standard analysis methods to determine quantity and composition of the impurities. The determination and quantification of non-volatile impurities, such as organic oils and greases, in the CO supply that feeds, for example, cleaning systems utilizing CO , is thus made possible.

Apparatus for analysis of impurities in liquid carbon dioxide

Liquid CO,is expanded in specially designed primary and secondary nozzles to produce frozen solid CO,. The impurities initially contained in the liquid CO,are trapped inside of the frozen CO,, which is collected in a clean container. The container is emptied on top of a high purity surface. The impurities are concentrated on the surface, since these impurities are non-volatile and do not escape with the CO,gas formed as the frozen CO,is heated by the ambient temperature to its sublimation point. After all of the frozen CO,has sublimed, the surface can be analysed by standard analysis methods to determine quantity and composition of the impurities. The determination and quantification of non-volatile impurities, such as organic oils and greases, in the CO,supply that feeds, for example, cleaning systems utilizing CO,, is thus made possible.

Apparatus and method for analysis of impurities in liquid carbon dioxide

An apparatus and method that enhances removal of contaminating particles from surfaces of a non-electrostatically sensitive components that are cleaned using a carbon dioxide cleaning spray. The apparatus includes a programmable power supply that is connected to ground and to the non-electrostatically sensitive component. The surface charge of the component is determined by cleaning the surface without adding any voltage or charge bias to the component. Then the surface is reversed-biased with a voltage having the opposite polarity by a large amount using the programmable power supply. The surface is then cleaned a second time, which removes the contaminating particles that were bound to the surface by electrostatic forces generated during the first cleaning. Thus, reversing the polarity of the charge on the surface that is to be cleaned removes the strong attraction between the contaminating particles and the surface and enhances removal of the contaminating particles from the surface.

Use of electrostatic bias to clean non-electrostatically sensitive

Apparatus and methods for removing particles from a surface of a semiconductor wafer or optical component using a carbon dioxide snow spray directed at the wafer or component while simultaneously irradiating the surface with a laser beam. The apparatus comprises a carbon dioxide jet spray cleaning system disposed within an environmental cleaning station of a processing system that processes the wafer or component. The processing system is a conveyorized system wherein a conveyor belt or web transports wafers or components from processing station to processing station. The cleaning station includes a recirculating blower system, a laminar flow screen, a high efficiency particulate air filter, and a ducting system for recirculating purified air or inert gas. The cleaning station contains a jet spray nozzle that produces a carbon dioxide snow spray. The jet spray nozzle is coupled by way of a manifold to a liquid carbon dioxide tank that supplies liquid carbon dioxide to the jet spray nozzle. The wafer or component is grounded to prevent static charge buildup. A carbon dioxide laser, operating at 10.6 microns, produces a laser beam that is generally aligned with the carbon dioxide snow spray so that the beam and spray overlap. The laser beam heats the surface of the wafer or component to compensate for the cooling effects of the carbon dioxide snow.

Wafer cleaning using a laser and carbon dioxide snow

Apparatus for cleaning, assembling, testing and inspecting contamination sensitive hardware. The apparatus includes an environmental process enclosure having an inner processing chamber, and a carbon dioxide jet spray cleaning system. The enclosure includes a loadlock pass-through having front and rear access doors for providing access to the inner processing chamber. A blower is disposed in the enclosure for circulating purified gas therethrough. A prefilter disposed prior to an inlet of the blower, and a high purity filter and laminar flow screen are disposed in the inner processing chamber. A heater is provided for heating the purified gas and a temperature controller is coupled to the heater for controlling the temperature of the purified gas. A table is disposed in the inner processing chamber upon which contamination sensitive hardware and testing and assembly apparatus may be placed. The carbon dioxide jet spray cleaning system includes a carbon dioxide delivery system for storing liquid carbon dioxide, and a valve assembly coupled to the carbon dioxide tank that is disposed in the inner processing chamber. The valve assembly is coupled to a nozzle and orifice assembly, which produces a spray of gas and solid carbon dioxide that is used to clean the contamination sensitive hardware.

Apparatus for cleaning and testing precision components of hard drives

A method of removing photoresist or redeposited material from a substrate or other surface using a carbon dioxide jet spray. A substrate having photoresist or redeposited material on its surface is disposed in an environmental enclosure. A carbon dioxide jet spray is generated and directed onto the surface of the substrate and photoresist or redeposited material. The carbon dioxide jet spray cools or freezes the material and causes a mismatch in the thermal coefficient of expansion of the material and the substrate. The material debonds from the substrate due to the induced thermal shock to the material. This rapid shrinkage loosens the material and allows the solid particles in the spray to knock the material from the surface of the substrate. The removed photoresist or redeposited material may be collected in a filter, and removed.

Photoresist and redeposition removal using carbon dioxide jet spray

An apparatus and method that enhances removal of contaminating particles from surfaces of a static-sensitive components that are cleaned using a carbon dioxide cleaning spray produced by a jet spray gun. The apparatus has a programmable power supply that is connected to ground, to the static-sensitive component, and to the jet spray gun. The static-sensitive component is cleaned using the cleaning spray and the surface charge generated on the surface of the component or substrate is simultaneously monitored to determine the amount and polarity of the charge that is generated thereon. The programmable power supply then applies a reverse bias to the jet spray gun that is equal to and has the opposite polarity of the charge that is generated on the surface of the static-sensitive component or substrate, which neutralizes the charge generated on the surface of the component.

Electrostatic discharge protection of static sensitive devices cleaned

A method of cleaning an integrated circuit chip module prior to attaching wire bonds thereto. The method involves disposing a module containing an integrated circuit chip and IC bond pads without wire bonds in an environmental process enclosure. A carbon dioxide jet spray cleaning system having a spray nozzle and orifice assembly is disposed the environmental process enclosure. A jet spray of carbon dioxide is generated using the jet spray cleaning system. The carbon dioxide jet spray is directed onto the surface of the module such that the spray impacts the IC bond pads and module bond pads to clean unwanted adhesive from the surface of the module and thus clean the IC and module bond pads.

Integrated circuit chip module cleaning using a carbon dioxide jet spray

Apparatus for cleaning a wafer carrying cassette. The cassette is fabricated as open top box having closed sides and a plurality of grooves formed in its interior that each hold a wafer. The apparatus includes an enclosure having an entry and an exit, and a conveyor is provided for transporting the cassette through the enclosure. A first plurality of jet spray nozzles are disposed adjacent to the entry that produce a carbon dioxide jet spray that cleans exterior surfaces of the cassette as it travels through the entry. A blower produces a flow of air through the enclosure and a filter filters the air flowing through the enclosure. A second plurality of moveable jet spray nozzles is controlled to move into the interior of the cassette to generate a carbon dioxide spray that cleans the interior of the cassette. An electrostatic control system is provided that controls buildup of electrostatic charge on the cassette caused by the carbon dioxide spray. Heaters control the temperature of the cassette at or above room temperature to prevent condensation.

Wafer cassette cleaning using carbon dioxide jet spray

A modular jet spray device for use in cleaning submicron sized particles and molecular films using CO.sub.2 spray. The modular jet spray device comprises a valve body having first and second ends and an gas input for receiving a CO.sub.2 cleaning agent. A jet spray nozzle is removably secured to the first end of the valve body and comprises an input orifice and an output orifice. A sleeve assembly is removably secured to the second end of the valve body, and a needle assembly is removably secured to the sleeve assembly. The needle assembly has a needle that inserts into the input orifice of the nozzle. A micrometer is removably secured-to the sleeve assembly distal from the valve body and is coupled to the needle assembly for adjusting the position of the needle relative to the inlet orifice of the jet spray nozzle. A CO.sub.2 gas source is coupled to the gas input of the valve body. Optionally, a filter may be coupled between the CO.sub.2 gas source and the gas input of the valve body. The modular jet spray device has a one piece nozzle and orifice that eliminates gaps that cause spitting, clogging, or ice crystal formation. The modular jet spray device provides for a much finer adjustment of spray parameters and is assembled from simple components in modular form. The modular design provides for a rapid matching of output orifice, nozzle, and needle combinations for optimized cleaning of submicron sized particles and molecular films.

Growing community of inventors

Torrance, CA, United States of America

Charles W Bowers