Suvolta, Inc.

Mie Fujitsu Semiconductor Limited

Advanced Technology Development Facility, Inc.

Charles Stager

Pushkar Ranade

Dalong Zhao

Lance A Scudder

Urupattur C Sridharan

Lance S Scudder

Lucian Shifren

Scott E Thompson

James Beach

Michael Duane

Andrew C Campbell

Uc Sridharan

Shuji Ikeda

Jeff Wetzel

Michael Gotskowski

A method for fabricating field effect transistors using carbon doped silicon layers to substantially reduce the diffusion of a doped screen layer formed below a substantially undoped channel layer includes forming an in-situ epitaxial carbon doped silicon substrate that is doped to form the screen layer in the carbon doped silicon substrate and forming the substantially undoped silicon layer above the carbon doped silicon substrate. The method may include implanting carbon below the screen layer and forming a thin layer of in-situ epitaxial carbon doped silicon above the screen layer. The screen layer may be formed either in a silicon substrate layer or the carbon doped silicon substrate.

Reducing or eliminating pre-amorphization in transistor manufacture

A method for fabricating a semiconductor structure so as to have reduced junction leakage is disclosed. The method includes providing substitutional boron in a semiconductor substrate. The method includes preparing the substrate using a pre-amorphization implant and a carbon implant followed by a recrystallization step and a separate defect repair/activation step. Boron is introduced to the pre-amorphized region preferably by ion implantation.

Semiconductor structure with substitutional boron and method for fabrication thereof

The present disclosure provides methods and structures for measurement, control, and monitoring the thickness of thin film layers formed as part of a semiconductor manufacturing process. The methods and structures presented provide the capability to measure and monitor the thickness of the thin film using trench line structures. In certain embodiments, the thin film thickness measurement system can be integrated with thin film growth and control software, providing automated process control (APC) or statistical process control (SPC) capability by measuring and monitoring the thin film thickness during manufacturing. Methods for measuring the thickness of thin films can be important to the fabrication of integrated circuits because the thickness and uniformity of the thin film can determine electrical characteristics of the transistors being fabricated.

Monitoring and measurement of thin film layers

Methods for fabricating semiconductor structures are provided. A first layer may be deposited onto a substrate followed by the deposition of a second layer onto the first layer. A plurality of line structures may be etched in the second layer. A third layer, deposited onto the plurality of line structures of the second layer, may subsequently be etched to expose the plurality of line structures in the second layer. The plurality of line structures in the second layer may be removed, leaving an etched third layer. The etched third layer may be used as a mask to etch the first layer to form a semiconductor structure in the first layer. In some respects, the methods may include steps for etching the substrate using the etched first layer. The methods may also provide annealing the etched substrate to form a corrugate substrate surface.

Methods for fabricating semiconductor structures

Growing community of inventors

Austin, TX, United States of America

Charles Stager