International Business Machines Corporation

Charles Robert Lamb

Charles Chaolee Tai

Elias Papanicolaou

Kang-Wah Li

Voya Rista Markovich

Mark Vincent Pierson

Bahgat Ghaleb Sammakia

Anthony P Ingraham

Morris Anschel

Michael D Lowell

Scott D Reynolds

Timothy Shawn Reny

Richard Gerald Murphy

Wayne R Storr

Wolfgang Mayr

Tamar A Powers

A method and apparatus for cooling electronic devices is suggested comprising of a thermally conductive, flexible, non-jointed cooling conduit able to house a coolant. The conduit is passed or pulled through apertures provided on two or more cold plates. The conduit and plates are then placed in thermal communication with the electronic device or assembly to be cooled. The flexibility of the conduit allows the conduit with plates to be rearranged as to conform to the contours of the device to be cooled.

Flexible cold plate having a one-piece coolant conduit and method

To achieve the above-mentioned objects, and other related ones a method and apparatus for cooling of an electronic assembly is suggested. The electronic assembly is placed in thermal contact with a monolithic, non-jointed flexible coolant conduit housing a coolant. A plurality of cold plates are then slipped over the conduit, through their indentation like opening along a peripheral edge of each plate. The conduit with plates is then bend so as to complement the contour of the assembly to be cooled.

Method for cooling electronic devices using a flexible coolant conduit

An apparatus for cooling an electronic assembly. The electronic assembly is placed in thermal contact with a single, continuous and monolithic coolant conduit capable of housing a coolant. A plurality of removable cold plates are coupled to the conduit, through their indentation like openings along a peripheral edge of each plate. The conduit with plates is then bent as to complement the contour of the assembly to be cooled in a three dimensional manner as required.

Apparatus for cooling electronic devices using a flexible coolant conduit

A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.

Method and apparatus for testing of integrated circuit chips

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Endwell, NY, United States of America

Charles Robert Lamb