International Business Machines Corporation

Charles R Tompkins, Jr

Vincent P Mulligan

Robert F Florence, Jr

Emanuele F Lopergolo

Lewis Sigmund Goldmann

Joseph Michael Sullivan

Wing Fung Yuen

Wing-Fung Yuen

A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.

Micro compliant interconnect apparatus for integrated circuit devices

A probe assembly consisting of a servo mechanism or actuator providing multi-direction motion; a probe mounting attached to the actuator; and pin probes attached to the probe mounting making an electrical connection to pins of a device or package under test. The pin probe includes a shaft terminating in an end section having a conical shaped recessed area. The conical feature contained in the probe allows the probe to contact a pin or array of pins that are less then ideally located, but within their geometrical tolerance. The probe assembly thus constructed, provides reliable test measurements. It also increases test throughout by minimizing test setup time when the DUT has misaligned or bent pins. The setup can be used on a manual probe station, or in a mass production bed of nails type tester. The assembly can also be in the form of a gang probe wherein pin probes are arranged in a bed of nails arrangement to make contact with all the pins of the DUT simultaneously. The mounting is connected via a single wire, a plurality of wires, or a wiring harness to a measurement system. The pin probe is particularly well suited for probing ends of pins of multiple diameters and different pin tip geometries during various testing and/or manufacturing operations.

Apparatus for probing ends of pins

A vacuum holding chuck is presented. The vacuum holding chuck of the present invention is particularly well suited for holding semiconductor wafers of multiple diameters during various testing and manufacturing operations. In an exemplary embodiment, the vacuum chuck comprises a body having a first surface and an opposing second surface, wherein the first surface includes first and second recessed circular platforms to receive wafers having first and second diameters, respectively. The second surface includes at least one recessed circular platform to receive a wafer having a third diameter. Each circular platform is defined at least in part by an annular shoulder and each circular platform further includes a vacuum trough which is connected to a vacuum source which when activated, evacuates the air from the vacuum trough and securely holds a wafer in place within the circular platform.

Multiple size wafer vacuum chuck

A universal mapping tool and method for mapping workpieces, such as semiconductor devices, is disclosed and described. The tool comprises a fixed and a movable gripping means adapted to mount a wide range of workpieces, means for optically locating the physical center of the workpiece fiducials mounted on the gripping means, and means for interpreting and storing the data obtained in the mapping operation.

Universal mapping tool

The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed. The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.

Growing community of inventors

Poughkeepsie, NY, United States of America

Charles R Tompkins, Jr