Hewlett Packard Enterprise Development LP

Charles R Hanna

John P Franz

Balaji Natrajan

Michael Lawrence Sabotta

Brian T Purcell

Henry F Lada

Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.

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Houston, TX, United States of America

Charles R Hanna