Bose Corporation

Digital Equipment Corporation

Other

Dolby Laboratories Licensing Corporation

Charles R Barker, Iii

J Richard Aylward

Barret Lippey

Klaus Hartung

Ricardo Federico Carreras

Michael B Nussbaum

David Martin Fenwick

Raymond O England

Richard E Olson

Gerald F Caron

Thomas C Schroeder

Adam Christopher Broders

Richard J Casabona

Richard A Aylward

Peter J Wagner, Ii

Stephen E Lindquist

Rakesh C Pandey

Robert S Sobolewski

David A Cease

Massimo Hartsarich

Dorie A Sabol

Osman K Isvan

Laura J Schroeder

Anthony G Esposito

Jr John Michael Kitchura

Alfred G Giombetti

A lens bears a plurality of roll-coated layers to pass, to one eye of a viewer, a first image, in a first band of wavelengths, that is appropriate for 3D viewing of a stereoscopic image.

Forming spectral filters

A multichannel audio system for radiating sound to a listening area that includes a plurality of listening spaces. The audio system includes directional audio devices, positioned in a first of the listening spaces, close to a head of a listener, for radiating first sound waves corresponding to components of one of the channels and nondirectional audio devices, positioned inside the listening area and outside the listening space, distant from the listening space, for radiating sound waves corresponding to components of a second of the channels.

Directional electroacoustical transducing

An acoustic device, including an acoustic enclosure and a first electroacoustical transducing apparatus comprising a motor structure providing mechanical vibration, the vibration having a direction of vibration, mounted in the acoustic enclosure. The acoustic device is constructed and arranged so that first pressure waves are radiated from a first radiation point and second pressure waves are radiated from a second radiation point and so that the first pressure waves and the second pressure waves destructively interfere at observation points relatively equidistant from the first and second radiation points. The acoustic device is further constructed and arranged to be structurally combined with a seating device so that the first radiation point is relatively close to the head of an occupant of the seating device and so that the second radiation point is relatively far from the head of the occupant. The acoustic device is further constructed and arranged to transmit the mechanical vibration to the seat back.

Seat electroacoustical transducing

A method for processing a multichannel audio signal. The method includes mounting electroacoustical transducers in a low frequency augmenting device. The electroacoustical transducers radiate different high frequency acoustic energy and common low frequency acoustic energy. The transducers may be part of directional arrays. The method is applied to multimedia entertainment devices.

Electroacoustical transducing with low frequency augmenting devices

A loudspeaker system having a dual voice coil for radiating sound waves from a multiple channel system. The loudspeaker system includes an audio signal input, a first driver having a first voice coil which has a first and a second voice coil winding, and a second driver having a voice coil which has a first and a second voice coil winding. The audio signal input is coupled to the second voice coil winding of the first driver and to the second voice coil of the second driver.

Multiple voicecoil and driver transducing

A loudspeaker system includes an upper frequency assembly that radiates acoustical energy having spectral components in the audio frequency range above a predetermined upper frequency, typically at the high end of the bass frequency range between 150 and 200 Hz. The assembly includes a ported enclosure with a front face enclosing a loudspeaker driver with a cone adjacent to the front face of diameter slightly less than at least one of the height and width of the enclosure.

Satellitic compact electroacoustical transducing

A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. The blower draws air in through the area between the fins, up the curved central portion and into the blower assembly where it is then exited out the sides of the fan. The fins may be smooth or textured, straight or curved. The fan heatsink assembly is attached to the device to be cooled. Heat is transferred from the electronic component, into the heat dissipating member where the fan causes air to be drawn up between the fins and along the curved center portion, removing heat from the heat dissipating member and the electronic component.

High performance fan heatsink assembly

A parallel air flow system which automatically maintains proper coolant flow regardless of the number of circuit boards installed in an enclosure. The enclosure is constructed such that air flow path through any one slot does not affect the air flow through any other slot. Proper air flow through the entire system is maintained by an air flow sensor disposed in an air flow path having a known air flow resistance. This sensor controls the speed of an air-mover in order to maintain a constant predetermined air flow through the known resistance, in such a way that a constant static air pressure is maintained at each slot. Baffle modules are preferably inserted into the enclosure to prevent air flow into any empty slots, to reduce the total air volume necessary to achieve the predetermined static pressure, thereby reducing the audible noise generated by the air-mover.

Adaptive cooling system

A package for integrated circuit chips, or other electrical devices, provides mechanical shock and thermal protection for the chips, and in addition, protects the chips from electromagnetic interference and electrostatic discharge. The package includes a printed wiring board base for reception of one or more circuit chips, and a conductive heat sink and cover. The conductive heat sink, in conjunction with a reference plane in the wiring board base, acts as an EMI shield for the chips. The heat sink is covered with an insulating layer, on top of which, a conductive coating is placed. The conductive coating is electrically connected to the reference plane, and the two act to protect the chips from electrostatic discharges. Compliant pads support the chips, and a thermally conductive elastomer can be placed on top of each chip between the chips and the inner top surface of the heat sink. The chips are thereby held securely in position, and are thermally connected to the heat sink.

Package for EMI, ESD, thermal, and mechanical shock protection of

A telephone has a first keypad provided with conventionally numbered touch tone keys. A second keypad has a plurality of transparent keys, each provided with a slot for the insertion of a small picture or symbolic representation. Optical fiber may be embedded in each of the transparent keys for illuminating the pictures. The telephone is provided for use with a conventional handset or as a speaker phone. Each of the keys in the second keypad are connected to actuate the speaker phone section of the telephone. The keys of the second keypad are each associated with a memory for the assignment of a telephone number associated with the picture or symbolic representation inserted within the key slot. A large emergency 911 key is also provided. The telephone is designed for use by small children.

Telephone

Growing community of inventors

Framingham, MA, United States of America

Charles R Barker, Iii