International Business Machines Corporation

Other

Charles P Coughlin

Robert H Cadwallader

Thomas J Walsh

Louis H Faure

Robert J Celestino

A bearing construction interposes the coils of one or more coil springs between bearing surfaces. In one embodiment a bearing coil spring is wrapped around a shaft several times. The bearing coil spring may be freely mounted on a more substantial race coil retainer centered on the shaft. In another embodiment toroidal coil springs separated by disc races extend circularly about the shaft. In linear bearing construction, the bearing coils are in planes parallel to the line of shaft movement. Other embodiments of the invention involve disengageable shafts having complementary centering end-faces accommodating misalignment through the yield able action of the bearing spring coils, shafts and housings having non-circular cross-sections, and shafts and housings not having completely complementary surfaces to enable interference fit and positional control.

Linear compensating bearing

A coaxial test probe employs a flexible inner conductor that buckles upon the application of an axial load is housed within a conductive outer sheath. The inner probe includes an insulating spacer which forms a recess applied to the protruding end of the inner conductor, such that buckling occurs within recess. A plurality of adjacent probes are mounted on a test fixture at opposing angles to facilitate automatic interrogation of closely spaced contact pads.

Coaxial probe

A test probe employing a buckling beam array for testing integrated circuits. A pair of identical sets of guides are positioned on either side of a centerpost to align the buckling beams. In one embodiment the holes in one set of guides is offset by a key to induce prebow in the beams. In another embodiment prebow is induced by a floating asymmetric separator positioned on the centerpost between the guide sets. When a force is applied to the probe, the beams deflect in the direction but to different extents so that a uniform force is applied to the surface of the IC irrespective of variations in height.

Modular test probe

Disclosed is a method of aligning a plurality of probes to a plurality of contacts, the contacts being arragned in a pattern on a substrate. The method includes the steps of powering one of a selected pattern of probes or a like pattern of selected contacts such that upon the selected patterns being in coincidence, the plurality of probes will be in contact with predetermined contacts on the substrate. This is accomplished by providing a circuit path through all of the other probes or contacts which are not powered and then bringing the plurality of probes into contact at random with the contacts of the substrate and then moving one of the substrate and probes until the selected patterns coincide as by indication of a completed circuit path between selected patterns.

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Chelsea, NY, United States of America

Charles P Coughlin