Micron Technology Incorporated

Micron Display Technology, Inc.

Aptina Imaging Corporation

Round Rock Research, LLC

Charles Martin Watkins

Kyle K Kirby

David A Cathey

William Mark Hiatt

Salman Akram

Warren M Farnworth

Alan G Wood

Peter A Benson

Sidney B Rigg

David R Hembree

Surjit S Chadha

Kevin Tetz

James M Wark

Danny Dynka

Mark E Tuttle

Thomas Gehrke

Robert T Rasmussen

Steven David Oliver

Lu Velicky

Nishant Sinha

Darryl M Stansbury

Zhongyi Xia

Jimmy J Browning

Cem Basceri

James J Hofmann

Jim J Browning

Derek J Gochnour

Jason B Elledge

Mark Hiatt

James J Hofman

Jim J Hofmann

Kyle K Kirkby

Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

Light emitting diodes with enhanced thermal sinking and associated methods of operation

Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

Microelectronic workpiece processing systems and associated methods of color correction

Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

Systems and methods for forming apertures in microfeature workpieces

Various embodiments of light emitting devices with built-in chromaticity conversion and associated methods of manufacturing are described herein. In one embodiment, a method for manufacturing a light emitting device includes forming a first semiconductor material, an active region, and a second semiconductor material on a substrate material in sequence, the active region being configured to produce a first emission. A conversion material is then formed on the second semiconductor material. The conversion material has a crystalline structure and is configured to produce a second emission. The method further includes adjusting a characteristic of the conversion material such that a combination of the first and second emission has a chromaticity at least approximating a target chromaticity of the light emitting device.

Light emitting devices with built-in chromaticity conversion and methods of manufacturing

A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.

Method for forming a light conversion material

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Eagle, ID, United States of America

Charles Martin Watkins