Isothermal Systems Research, Inc.

Other

Parker-hannifin Corporation

Dcg Systems Gmbh

Parker Intangibles LLC

Credence Systems Corporation

Isothermal Research Systems, Inc.

Charles Lester Tilton

Donald E Tilton

Tahir Cader

George Joseph Wos

Randall T Palmer

Douglas W Miller

William J Beasley

Jeffery K Weiler

Nathan G Muoio

Bruce A Smetana

Benjamin Hewett Tolman

Ryan J Baddeley

Jonathan Frank

Thomas Wong

Thomas D Weir

Alan Brent Roberts

Philip W Appel

Paul Allan Knight

William C Gustafson

Vivek Sahai

Harley West

Chester L Turner

Randal T Palmer

Jeff Weiler

John D Schwarzkopf

Sammy Lee Zimmerman

Kevin D Seaney

Angela R Maehren

Tom D Weir

Tony E Hyde

Norman O Alder

Jeffrey K Weiler

Donald D Tilton

A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis

Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition.

Pumping system resistant to cavitation

Representative embodiments provide for corresponding fluid atomizer bodies, each generally defining a fluidicly communicative interior cavity. The interior cavity is typically defined by an entry passageway portion, a chamber portion, a plurality of feeder passageways that are tangentially disposed to and fluidly coupled with the chamber portion, and an exit passageway portion fluidly coupled to the chamber portion. In one embodiment, an upper body portion and a lower body portion are bonded together to define a complete fluid atomizer body. Another embodiment provides for producing one or more fluid atomizer bodies by a way of injection molding.

Methods and apparatus for atomization of a liquid

Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

Narrow gap spray cooling in a globally cooled enclosure

A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.

Combination spray and cold plate thermal management system

A spray cooled motor system with a motor housing with an interior and an exterior, a stator mounted within the interior of the motor housing, a rotor mounted within the interior of the motor housing, a coil winding mounted within the interior of the motor housing, a plurality of atomizers configured to spray a coolant on at least one of the stator and the rotor, a coolant pump in fluid communication with the plurality of atomizers; and an output shaft extending through an output shaft aperture from the interior to the exterior of the motor housing.

Spray cooled motor system

A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.

Thermal management system for evaporative spray cooling

An insulated spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The insulated spray cooling system for extreme environments includes an insulated enclosure that isolates the electronic devices being thermally managed from the external environment and a thermal management unit within the enclosure for thermally managing electronic devices.

Insulated spray cooling system for extreme environments

An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.

Azeotrope spray cooling system

A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

Passive fluid recovery system

A heat exchanger system for efficiently thermally managing coolant within a multiple-phase thermal management system. The heat exchanger system includes a thermal management unit, a release valve within the thermal management unit to release vaporized coolant, and a heat exchanger fluidly connected to the release valve and to the thermal management unit to return liquid coolant to the thermal management unit.

Heat exchanger system

In accordance with one embodiment of the present disclosure an apparatus includes a means for converting a first type of electrical power to a second type of electrical power. The apparatus also includes a means for spraying a coolant on the means for converting.

Spray cool means for cooling a modular inverter electric motor system

The present invention uses multiple global cooling chambers for providing liquid cooling to a plurality of electronic components. The global cooling chambers utilize a non-electrically conductive fluid which is in direct contact with the components to be cooled. The system provides very effective heat transfer rates, environmental isolation of the electronics components and can be deployed in a wide range of applications. Multiple global cooling chambers allows for the hot swapping of cards during operation of the system. Valves provide the ability to minimize the amount of interaction between the cooling fluid and air outside the chambers.

Method of reducing fluid emissions from a global spray cooling system

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Colton, WA, United States of America

Charles Lester Tilton